Heat dissipating module

Abstract

The invention discloses a heat dissipating module comprising a heat tube set, a heat dissipating baseplate and a heat dissipating fin set. The heat dissipating baseplate is provided with a plurality of hollowed-out areas. Riveting grooves of heat dissipating fins are formed in the first surface of the heat dissipating baseplate, two opposite edges, in each hollowed-out area, of a heat tube pier are arranged on the second surface of the heat dissipating baseplate, and the second surface contacts with a chip. The heat dissipating fin set is formed by cross distribution of a plurality of projection areas and a plurality of non-projection areas and fastening of a plurality of fasteners, each of the projection areas and the non-projection areas comprises a plurality of heat dissipating fins in parallel arrangement, each of the projection areas is provided with a plurality of heat tube accommodating grooves, the tail ends of the heat dissipating fins of the projection areas are bent to be L-shaped so as to abut against the chip, the projection areas of the heat dissipating fin set project from the hollowed-out areas of the heat dissipating baseplate respectively after riveting, the plane where the L-shaped abutting portions abut against the chip, the riveted second surface of the heat tube set in the hollowed-out areas and the second surface of the heat dissipating baseplate are on the same plane obviously.

Description

technical field [0001] The present invention relates to a heat dissipation module, in particular to a heat dissipation module applied to a 1U server or a blade server. The heat pipe with high heat conduction efficiency directly contacts the heat source of the chip, and directly guides the heat generated by the chip to the heat dissipation fins, thereby Improve the performance of 1U server cooling modules. Background technique [0002] Unlike typical desktop or laptop computers, users shut down their computers (or at least hibernate them) after use. Except for specific maintenance days, the server is almost open all year round. In addition, the server serves large enterprise users or cloud users, and most of the time it is in a state of high-speed operation. Therefore, for the cooling of the CPU, the reliability requirement is particularly strict. [0003] Especially for 1U servers, it puts each server flat on a rack. The height of each server is only about 1U unit (4.445c...

AI Technical Summary

Problems solved by technology

However, the heat pipe group 30 does not directly touch the cooling fin group 20, and there is an aluminum cooling bottom plate 40 with poor heat conduction efficiency (the thermal conductivity coefficient of aluminum is about 205Watt / m-°C and copper is about 400Watt / m-°C), so that It is more difficult for the heat dissipation fin set 20 to exert its heat dissipation performance

Although the combination of components 20, 30, and 40 of the heat dissipation module does not need to go through a reflow furnace, the aluminum base plate or heat dissipation fins do not need to be nickel-plated, and the expensive copper base plate is also saved. Although the cost can be greatly reduced, the performance is poor. Vapor chamber

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