Loading machine and loading method

Abstract

The invention provides a plate feeding machine which comprises a plate feeding machine body and a weighing device, wherein the plate feeding machine body comprises a servomotor, a mechanical arm and a transmission roller wheel; the servomotor drives the mechanical arm to move; the transmission roller wheel is positioned on one side of the mechanical arm; the weighing device comprises a weigher body, a grid-shaped base plate placement platform arranged on the weigher body, a cylinder connected with the grid-shaped base plate placement platform, a display device connected with the weigher body and a control device connected with the display device; the weigher body and the cylinder are positioned below the transmission roller wheel; the grid-shaped base plate placement platform is crossed with the transmission roller wheel; wheels of the transmission roller wheel are positioned in grids of the grid-shaped base plate placement platform. By virtue of up-and-down control of the cylinder, the grid-shaped base plate placement platform is enabled to be lower than or higher than the transmission roller wheel. The invention further provides a plate feeding method. According to the plate feeding machine and the plate feeding method, the base plate for each plate feeding is weighed, and contrastive analysis is performed on the weighing value and a reference value so as to judge whether plates are to be overlapped, and plate overlapping is prevented by virtue of a further treatment.

Description

technical field [0001] The invention relates to the field of electronic product processing, in particular to a board loading machine and a board loading method. Background technique [0002] With the rapid development of electronic products in the direction of miniaturization, high density, high integration and multi-function, the requirements for printed circuit boards (Printed circuit board, PCB) are getting higher and higher. PCBs to high-precision IC substrates, and printed circuit boards are also developing towards miniaturization, high density, and high integration. Not only the requirements for technology are getting higher and higher, but also the requirements for production equipment are getting higher and higher. As long as one party fails to meet the requirements, it is impossible to produce high-quality IC substrates. [0003] The board loading machine is one of the automation equipment commonly used in the PCB production line. It needs to absorb and lift the PC...

AI Technical Summary

Problems solved by technology

When producing IC carrier boards, since the board thickness can be as low as 0.04MM and the quality is small, the static electricity generated during the production process cannot be ignored. Multiple sheets are picked up, resulting in stacked boards, and the stacked substrates continue to flow to the next step, which may cause huge economic losses

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