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Dispensing method of LED and manufacturing method of high-power LED lamp

An LED chip and glue dispensing technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of inability to effectively adjust the dispensing temperature, unable to detect abnormal temperature in time, etc., and achieve the effect of high practical value

Inactive Publication Date: 2017-09-26
SPIMAGE XIAMEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the dispensing process, the existing technology cannot detect temperature abnormalities in time, nor can it effectively adjust the dispensing temperature

Method used

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  • Dispensing method of LED and manufacturing method of high-power LED lamp

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Embodiment Construction

[0027] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0028] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used in the description of the present invention in this specification are o...

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Abstract

The invention provides a glue dispensing method for LEDs and a manufacturing method for high-power LED lamps; wherein, the glue dispensing method for LEDs includes the following steps: during glue dispensing and baking, detect the glue dispensing baking temperature in real time, and judge that it exceeds the preset temperature. When setting the temperature threshold range, reversely adjust the preset temperature change value. By adopting the above scheme, the present invention can effectively control the dispensing and baking temperature, which is particularly accurate, and avoids the low yield of dispensing products caused by the temperature being too high or too low, and has high practical value.

Description

technical field [0001] The invention relates to a glue dispensing process for LEDs, in particular to a method for dispensing glue for LEDs and a method for manufacturing high-power LED lamps. Background technique [0002] With the development of technology, the dispensing process of LED has become mature. [0003] For example, Chinese patent 201010019287.4 discloses a glue dispensing process for white light LEDs. Specifically, it discloses a method that can improve the color concentration and reliability of white light LEDs and maximize the rational use of resources and energy. The steps are to mix phosphor and glue ——Preserve the phosphor powder and glue mixture at a constant temperature—Stir the phosphor powder and glue mixture preserved at a constant temperature—Pour the phosphor powder and glue mixture into the temperature-adjustable syringe and use a mechanical screw dispenser to dispense glue——Use a special The thermal insulation material box is sent to the constant t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52H01L33/48H01L33/00
Inventor 潘小和
Owner SPIMAGE XIAMEN CO LTD
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