Chemical copper deposition method of PCB with small aperture and high aspect ratio

Abstract

The invention relates to the technical field of chemical copper deposition, and discloses a chemical copper deposition method of a PCB with a small aperture and a high aspect ratio. The chemical copper deposition method is characterized by comprising the following steps: 1) grinding the PCB on a grinding line, and 2) depositing copper on the PCB on a copper deposition line, wherein the PCB is grinded, washed with water and dried with strong wind sequentially in the step 1). By adopting the chemical copper deposition method provided by the invention, after the PCB passes through the grinding line and the copper deposition line and is washed with water on the grinding line in sequence, pores in the PCB can be relatively well washed, the walls of the pores are also completed wetted, and after the later strong wind blowing step, as the temperature of the strong wind is identical to the external temperature and no high temperature is generated, and the walls of the pores can be kept wet without being completed dried; as the walls of the pores are not affected by the surface tension, molten copper can be completely fed into the pores, the whole walls can be completely deposited with copper, the phenomenon of open circuit of the PCB can be avoided, and the quality of the PCB can be ensured.

Description

technical field [0001] The invention relates to the technical field of electroless copper deposition methods, in particular to the electroless copper deposition method for PCB boards with small apertures and high aspect ratios. Background technique [0002] The production process of multi-layer PCB board is: material cutting→inner layer graphics→inner layer etching→pressing→drilling→electroless copper deposition (including desmear)→full board plating→outer layer graphics→graphic plating→outer layer etching →Solder mask→Character→Surface treatment→Molding→Final inspection→Packaging. The function of electroless copper deposition is to form a conductive copper layer in the hole, so that the layers are connected to each other. If the electroless copper deposition is not good, it will cause the PCB board to be "open circuit" and cannot be used. [0003] With the continuous upgrading of electronic products, the design lines of PCB boards are becoming more and more refined, formin...

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Problems solved by technology

[0006] The object of the present invention is to provide the electroless copper deposition method of small hole high aspect ratio PCB board, aims to solve the electroless copper deposition method of PCB board in the prior art, the hole of the PCB board after grinding board is too dry and in the chemical Copper failed to sink into the sinking copper wire, resulting in an open circuit on the PCB board, making it unusable

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