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Polishing apparatus

A technology of grinding device and grinding pad, which is applied in the direction of grinding device, grinding machine tool, parts of grinding machine tool, etc.

Active Publication Date: 2015-06-03
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the above-mentioned pressure regulator 15, it is difficult to follow the moment and the magnitude of the change in the pressure fluctuation always changes.

Method used

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Experimental program
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Embodiment Construction

[0103] Embodiments of the present invention will be described below.

[0104] A grinding device according to an embodiment of the present invention has a figure 1 as well as figure 2 The grinding devices shown have substantially the same structure, so that a repeated description thereof is omitted. Figure 10 is a schematic diagram showing one embodiment of the regulator 15 . The pressure regulator 15 includes: a pressure control valve 16 for adjusting the pressure of the gas in the pressure chamber 10; a pressure gauge 17 for measuring the pressure of the gas on the downstream side of the pressure control valve 16 (secondary side pressure); The valve control unit 25 controls the operation of the pressure control valve 16 so that the difference (deviation) between the pressure target value Pc and the pressure value Pact measured by the pressure gauge 17 is minimized. The secondary side pressure corresponds to the pressure in the pressure chamber 10 . The target value Pc i...

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PUM

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Abstract

A polishing apparatus capable of stably controlling a pressure in a pressure chamber of a top ring is disclosed. The polishing apparatus includes: a rotatable polishing table for supporting a polishing pad; a rotatable top ring having a pressure chamber for pressing a substrate against the polishing pad; a pressure regulator configured to regulate a pressure of a gas in the pressure chamber; and a buffer tank provided between the pressure chamber and the pressure regulator. The pressure regulator includes a pressure-regulating valve, a pressure gauge configured to measure the pressure of the gas at a downstream side of the pressure-regulating valve, and a valve controller configured to control an operation of the pressure-regulating valve so as to minimize a difference between a target value of the pressure in the pressure chamber and a pressure value measured by the pressure gauge.

Description

technical field [0001] The present invention relates to a polishing device for pressing a substrate such as a wafer against a polishing pad to polish the surface of the substrate, and more particularly to a polishing device for pressing a substrate against the polishing pad using a pressure chamber supplied with pressurized gas inside. [0002] Also, the present invention relates to a polishing apparatus for polishing a substrate such as a wafer, and more particularly, to a polishing apparatus provided with a pressure regulator for controlling the pressure in a pressure chamber for pressing the substrate against a polishing pad. Background technique [0003] A CMP (Chemical Mechanical Polishing) apparatus is an apparatus for polishing a surface of a substrate by pressing a substrate such as a wafer against the polishing pad while supplying a polishing liquid onto the polishing pad. The CMP apparatus is known as a polishing apparatus used in the manufacture of semiconductor d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/10B24B37/34
CPCB24B37/04B24B37/005B24B37/32B24B49/08
Inventor 篠崎弘行高桥信行丸山彻作川卓锅谷治
Owner EBARA CORP