edge exposure device

Abstract

The invention discloses an edge exposure device. The edge exposure device comprises an adsorption and rotating platform for adsorbing and driving a silicon chip to rotate, a motor for supplying power for the adsorption and rotating platform, an edge exposure lens assembly comprising an edge exposure camera lens and an exposure spot monitoring lens, wherein along an optical propagation direction, the edge exposure camera lens orderly comprises an exposure light source, first and second fly-eye lenses, a first cylindrical surface zoom lens group and a second cylindrical surface zoom lens group orthogonal to the first cylindrical surface zoom lens group, and a controller for controlling the motion of the motor, the edge exposure camera lens and the exposure spot monitoring lens. Through respective adjustment of combined focal length of the first cylindrical surface zoom lens group and the second cylindrical surface zoom lens group, edge exposure field length and width are controlled respectively, through cooperation of the first and second fly-eye lenses and the first and second cylindrical surface zoom lens groups, an exposure field is obtained, and through coaxial exposure field light spot imaging or energy detection light path, automatic focusing, exposure dosage and exposure size monitoring functions are obtained.

Description

Technical field [0001] The invention relates to a silicon wafer edge exposure process, in particular to an edge exposure device. Background technique [0002] Wafer edge exposure (WEE) is one of the very important processes in the front-end manufacturing of IC circuits. Such as figure 1 with figure 2 As shown, due to the existence of cracks on the edge 11 of the silicon wafer, the notch 12 (Notch) for determining the direction, the residue of the photoresist, the contaminants cleaned, the unevenness of coating, etching, and polishing, etc., the silicon edge 11 cannot Even if the entire edge of the silicon wafer is covered with chips, it will still become a waste piece due to the problem of the edge 11 of the silicon wafer. This requires the photoresist on the edge 11 of the silicon wafer to be exposed and removed in advance. [0003] Plating In the IC circuit packaging process, the edge 11 of the silicon wafer is used as the anode, and the electroplating window in the middle of t...

AI Technical Summary

Problems solved by technology

Since the energy loss has a quadratic relationship with the blocked area at the aperture, the energy efficiency problem becomes particularly serious when the exposure field size is required to be adjustable.

The US Patent No. US2002 / 0092964A1 discloses another edge exposure system including an edge exposure lens and a distance sensor. The function of the distance sensor is to measure the distance from the lens to the surface of the silicon wafer, so as to adjust the position of the lens as a whole before exposure , this method of determining the focal plane is only the result of calibration conversion, and does not represent the real best focal plane, and the method of adjusting the best focal plane is slightly complicated, and there is no ability to monitor exposure size and dose

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