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Heat conduction plate and heat radiation module comprising heat conduction plate

A heat dissipation module and heat conduction plate technology, which is applied to semiconductor devices, indirect heat exchangers, heat exchange equipment, etc., can solve problems such as failure and damage of electronic components, and achieve the effect of increasing the surface area and improving the heat dissipation effect

Inactive Publication Date: 2015-06-03
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of an increase in the total heat generated by electronic components, electronic components may fail or even be destroyed due to excessive temperature

Method used

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  • Heat conduction plate and heat radiation module comprising heat conduction plate
  • Heat conduction plate and heat radiation module comprising heat conduction plate
  • Heat conduction plate and heat radiation module comprising heat conduction plate

Examples

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Embodiment Construction

[0027] The detailed features and advantages of the present invention are described in detail in the following embodiments, and the content is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the protection scope of claims and With the accompanying drawings, any person skilled in the art can easily understand the related objects and advantages of the present invention. The following examples further illustrate the concept of the present invention in further detail, but are not intended to limit the scope of the present invention in any way.

[0028] First, see Figure 1A and Figure 1B , Figure 1A It is a schematic structural diagram of a thermally conductive plate disclosed according to an embodiment of the present invention, Figure 1B It is a schematic structural diagram of a heat dissipation module disclosed according t...

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Abstract

The disclosure relates to a heat conductive plate and a heat dissipating module using the same. The heat dissipating module is adapted for dissipating the heat generated by a heat source. The heat dissipating module includes a heat pipe and the heat conductive plate. The carrier unit has a first surface and a second surface opposite to each other. The first surface thermally contacts with the heat pipe. The second surface thermally contacts with the heat source. The extending unit is disposed on the first surface of the carrier unit. The extending unit includes a first extending section. The first extending section extends away from the first surface of the carrier unit.

Description

technical field [0001] The present invention relates to a heat-conducting plate and a heat-dissipating module including the heat-conducting plate, in particular to a heat-conducting plate with better heat dissipation efficiency and a heat-dissipating module including the heat-conducting plate. Background technique [0002] As the performance of various electronic components in an electronic device improves, the power consumed by the electronic components and the total heat generated by the electronic components also increase. When the total heat generated by the electronic components increases, the electronic components may fail or even be damaged due to excessive temperature. Therefore, in order to maintain the normal operation of the electronic device while improving the performance of the electronic device, it is necessary to further improve the heat dissipation capability of the electronic device. SUMMARY OF THE INVENTION [0003] In view of the above problems, the pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH01L23/4006H01L23/427H01L2924/0002F28D15/0275F28F2275/122H01L2924/00F28D15/02
Inventor 吴府融
Owner INVENTEC PUDONG TECH CORPOARTION