Producing method of suspension board with circuit

一种制造方法、悬挂基板的技术，应用在印刷电路制造、金属芯电路制造、印刷电路等方向，能够解决连接可靠性降低、花费劳力和时间、蚀刻时间长等问题，达到防止过蚀刻的效果

Active Publication Date: 2015-06-10
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, it is necessary to set the etching time to be longer, and in this way, there is a disadvantage that the first terminal and / or the second terminal are over-etched.
Therefore, there is a disadvantage that the connection reliability of the first terminal and / or the second terminal is reduced.
[0010] On the other hand, it is also required to protect the surface of the first terminal and / or the second terminal by using an electrolytic plating layer made of gold or the like by electrolytic plating. continuous plated leads, which sometimes takes labor and time

Method used

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  • Producing method of suspension board with circuit
  • Producing method of suspension board with circuit
  • Producing method of suspension board with circuit

Examples

Experimental program
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Embodiment Construction

[0057] Structure of this embodiment

[0058] in figure 1 In this case, the upper side of the paper is the front side (one side in the first direction), the lower side of the paper is the back side (the other side in the first direction), and the left side of the paper is the left side (in the first direction). The side in the second direction perpendicular to the width direction), the right side of the paper is the right side (the other side in the second direction, the other side in the width direction), and the paper thickness of the paper The direction near the front side is the upper side (the side in the third direction orthogonal to the first and second directions, that is, the side in the thickness direction), and the deep side of the paper in the paper thickness direction is the lower side (the third direction , The other side in the thickness direction). figure 2 The directions of the subsequent figures are figure 1 The direction of the reference.

[0059] in Figure 1 ...

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Abstract

A method for producing a suspension board with circuit includes the steps of (7) removing a first electroless plating layer corresponding to a first terminal and / or a second electroless plating layer corresponding to a second terminal by etching, (8) removing a metal supporting board in contact with the lower surface of a first conductive layer filling the inside of a first opening portion, and (9) providing an electrolytic plating layer on the surface of the first terminal with the first electroless plating layer removed and / or the surface of the second terminal with the second electroless plating layer removed and the lower surface of the first conductive layer exposed from the inside of the first opening portion by electrolytic plating supplying electricity from the metal supporting board.

Description

Technical field [0001] The present invention relates to a method of manufacturing a suspension board with circuit, and more specifically, to a method of manufacturing a suspension board with circuit for a hard disk drive. Background technique [0002] In order to increase the degree of freedom in the design of the conductor layer, there is known a suspension board with circuit in which a first insulating base layer, a first conductor layer, a second insulating base layer, and a second conductor layer are sequentially stacked on a metal supporting substrate. . In such a suspension board with circuit, for example, the element-side terminal contained in the first conductor layer is electrically connected to the piezoelectric element, and the magnetic head-side terminal contained in the second conductor layer is electrically connected to the magnetic head. Then, This suspension board with circuit is used for a hard disk drive. [0003] As a method of manufacturing such a suspension b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22G11B5/84
CPCH05K3/4661C25D5/02G11B5/4873H05K1/056H05K3/44H05K3/241H05K2203/072H05K2203/0723
Inventor 田边浩之金川仁纪
Owner NITTO DENKO CORP
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