Chip bonding device and chip bonding method

Abstract

A chip adhesive pressing device comprises an installing support, a bearing beam, a pressing part and a force application device, wherein one end of the installing support is arranged on a chip bearing table, the other end of the installing support is provided with a movable mechanism, the bearing beam protrudes out of the installing support, one end of the bearing beam is fixed to the installing support, the other end of the bearing beam is suspended, a through hole is formed in the suspended end, the pressing part further comprises a guide column, a pressing plate at one end of the guide column and an elastic component arranged between a liner of the guide column and the upper surface of the bearing beam in an abutting mode, the force application device further comprises a handle and a supporting rod, one end of the handle is connected with the movable mechanism of the installing support, the other end of the handle is a force application part, one end of the supporting rod is connected with the portion, not at the end, of the handle, and the other end of the supporting rod is connected with a locking part at one end of the guide column. The installing support, the bearing beam, the pressing part and the force application device are disposed on the chip bearing table, body scalding caused in the chip adhesive pressing process is avoided, stress is balanced, fixation height is consistent, the process is efficient and stable, the yield of products is increased, and the device is worthy of wide popularization.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a chip bonding device and a chip bonding method. Background technique [0002] At present, the chip carrying platforms of manual grinders all adopt a manual working mode, so that the chips are fixed on the carrying platforms. Specifically, hot melt glue is firstly coated on the back of the chip, and then the chip is fixed on the carrier platform by pressing and applying force with artificial fingers. [0003] Obviously, the manual method of fixing chips is not only too slow, time-consuming and labor-intensive, but also due to the difference in the force applied by fingers, the height and position of chips fixed on the carrier are also different, thus affecting product quality. Rate. In addition, during the process of pressing and applying force with the fingers, the operator is very likely to come into contact with the high-temperature hot melt adhesive, whi...

AI Technical Summary

Problems solved by technology

[0006] The present invention is aimed at the problem that in the prior art, traditional chip bonding adopts a manual working method to fix the chip, which is not only too slow, time-consuming and labor-intensive, but also the chip is fixed on the carrier due to the difference in the strength of the finger pressing force. The high and low positions are also different, which affects the product yield, and in the process of finger pressing, the operator is very easy to touch the high-temperature hot melt adhesive, which will cause finger burns and cause certain hidden dangers to personal safety and health, etc. The defect provides a chip bonding device

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