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Electronic equipment
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A technology of electronic equipment and electronic components, applied in the direction of electrical equipment shells/cabinets/drawers, electrical components, etc., can solve problems such as resin cracks, and achieve the effect of light weight and low price
Active Publication Date: 2018-10-23
SHINDENGEN ELECTRIC MFG CO LTD +1
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[0003] If a large current flows through the electronic components constituting such a power supply circuit and the resin around the electronic components is excessively heated, cracks may occur in the resin
Method used
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no. 1 approach 〕
[0033] Below, refer to Figure 1~3 A first embodiment of the present invention will be described.
[0034] Such as figure 1 , 2 As shown, the electronic device 1 of this embodiment has a substrate 2 , an electronic component 3 , a case 4 , a metal cover 5 , and a sealing resin 6 .
[0035] A wiring pattern (not shown) made of, for example, copper foil or the like is formed on the substrate 2 . The wiring pattern is a component that electrically connects the electronic components 3 mounted on the substrate 2 to each other appropriately to form a circuit of the electronic device 1 . The substrate 2 of the present embodiment is, for example, a multilayer wiring substrate on which a plurality of wiring patterns are overlapped. In addition, the substrate 2 can be, for example, as figure 2 In that case, it is formed as a rectangular shape in plan view, but it is not limited thereto.
[0036] The electronic component 3 is provided on the mounting surface 2 a of the substrate 2...
no. 2 approach 〕
[0065] Next, refer to Figure 5-9 A second embodiment of the present invention will be described.
[0066] Such as Figure 5 As shown, the electronic device 20 of the present embodiment has the same configuration as the electronic device 1 of the first embodiment except for the shape of the metal cover 5 . In this embodiment, only the differences from the first embodiment will be described, and the same reference numerals and the like will be attached to the same constituent elements as in the first embodiment, and description thereof will be omitted.
[0067] In the electronic device 20 of the present embodiment, a part of the side wall portion 12 of the metal cover 5 is in close contact with the side surface 2 c of the substrate 2 as in the first embodiment.
[0068] In addition, the side wall portion 12 of the metal cover 5 of this embodiment may be formed to have the same communication hole 13 as that of the first embodiment (refer to figure 1 , 2 ), but can also e.g. ...
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Abstract
This electronic device comprises: a substrate; electronic parts provided to a mounting surface of the substrate; a metal cover which covers the electronic components provided to the substrate; a case which houses the substrate, the electronic components, and the metal cover; and a sealing resin which fills the interior of the case. The sealing resin embeds the substrate and the electronic components, and furthermore, fills the space on both the interior and exterior sides of the metal cover.
Description
technical field [0001] The present invention relates to electronic equipment. Background technique [0002] Conventionally, in order to cope with vibration and heat dissipation in electronic equipment mounted on vehicles, etc., for example, as in Patent Document 1, a structure in which various electronic components are mounted on a substrate is accommodated in a case, and resin is filled in the case. (such as epoxy resin), so that the electronic circuit including electronic components and substrates is sealed (embedded). In addition, among electric circuits of electronic equipment, there is a circuit (power supply circuit) that is directly connected to a power source such as a battery and flows a large current. [0003] When the resin around the electronic component is excessively heated due to a large current flowing through the electronic component constituting such a power supply circuit, cracks may occur in the resin. The cracks travel linearly at the shortest distance...
Claims
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Application Information
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