Thermal compensation structure of release

Abstract

The invention discloses a thermal compensation structure of a release. The thermal compensation structure comprises a bottom plate, a working bimetallic strip, a compensation bimetallic strip and a transmission rod, the working bimetallic strip and the compensation bimetallic strip are installed on the bottom plate and are opposite in bending direction when heated, the transmission rod is rotatably installed on the bottom plate, one end of the transmission rod is fixedly connected with the compensation bimetallic strip, the other end of the transmission rod is connected with the working bimetallic strip, a thermal insulation wall is arranged between the working bimetallic strip and the compensation bimetallic strip to separate the installation space of the working bimetallic strip from the installation space of the compensation bimetallic strip, and a convection hole communicated with the outside environment is formed in the independent space where the compensation bimetallic strip is located. Because of the design of the release, the influences of environment temperature variation on bending changes of the working bimetallic strip are counteracted through the compensation bimetallic strip, the releasing performance of a product is improved, and the environment temperature adaption range of the product is widened.

Description

technical field [0001] The invention relates to the technology in the field of trip units, in particular to a thermal compensation structure of the trip unit. Background technique [0002] The traditional release is to set the working double gold on the circuit. When the circuit is overloaded, heat will be generated. The working double gold will bend and change due to the overload temperature of the circuit, thereby triggering the action of the pull rod, so that the dynamic and static contacts of the contact mechanism of the circuit protector Separation, so as to play the role of overload protection. [0003] However, conventional working bi-metals cannot counteract the effect of bending due to ambient temperature. For example, in hot summer, the external environment is as high as 30-40°C. The working double metal is not only affected by the heat change caused by the circuit overload fault, but also affected by the external environment temperature. Therefore, even if the ci...

AI Technical Summary

Problems solved by technology

However, in the cold winter, the external ambient temperature is low, sometimes as low as -10 to -20°C. Since the external ambient temperature will offset the heat generated by a part of the circuit overload, even if the circuit is overloaded, the bending change of the working double metal will not change. Obviously, there will be a problem of poor tripping

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