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Thermal interface materials and related systems and methods

A technology of thermal interface materials and thermally conductive materials, which can be used in heat transfer modification, heat exchange equipment, lighting and heating equipment, etc., and can solve problems such as low thermal conductivity

Inactive Publication Date: 2017-11-28
GM GLOBAL TECH OPERATIONS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Many pastes or greases used as thermal interface materials have relatively low thermal conductivity

Method used

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  • Thermal interface materials and related systems and methods
  • Thermal interface materials and related systems and methods
  • Thermal interface materials and related systems and methods

Examples

Experimental program
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Embodiment Construction

[0051] The embodiments of the present invention will be best understood with reference to the drawings, in which the same parts are always indicated with the same reference numerals. It will be readily understood that the components of the disclosed embodiments as shown and generally described in the drawings herein can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the system and method of the present invention is not intended to limit the scope of the present invention as claimed, but merely represents possible embodiments of the present invention. In addition, unless otherwise indicated, the steps of the method do not need to be performed in any particular order or even sequentially, and the steps do not need to be performed only once.

[0052] In some cases, well-known features, structures, or operations are not shown or described in detail. Furthermore, in one or more embodiments, the de...

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Abstract

The present invention relates to thermal interface materials and related systems and methods. Disclosed herein are various embodiments of thermal interface materials that can be used in various systems and methods to improve heat transfer. One embodiment in accordance with the present invention includes a heat dissipation system including a heat source and a heat sink. A thermal interface material may be disposed at least partially between the heat source and the heat sink. The thermal interface material may include a plurality of strands of thermally conductive material woven in a pattern. The thermal interface material can be configured to follow the contact surfaces of the heat source and the heat sink, and thereby enhance heat transfer between the heat source and the heat sink.

Description

Technical field [0001] The present invention relates to thermal interface materials. More specifically, but not exclusively, the present invention relates to a braided thermal interface material that can be disposed between a heat source and a heat dissipation component. Background technique [0002] Various heat sources can be cooled using heat sinks. The heat sink can be configured to dissipate heat to the surrounding environment. Some heat sinks may also include heat transfer elements such as heat sinks, fans, heat pipes, liquid cooling elements, phase change cooling elements, and / or other features. Thermal interface materials can be used to improve the thermal coupling between the heat source and the heat sink. The thermal interface material may be disposed between the contact surface of the heat source and the heat sink that transfers heat. [0003] The contact surface on the heat source or heat sink may have changes caused by changes in materials and / or manufacturing proc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01M10/613H01M10/653
CPCF28F3/12F28F13/00F28F2013/006H01M10/653H01M10/6567Y02E60/10H01M10/65H01M10/613F28F21/08
Inventor L.施瓦布C-C.苏
Owner GM GLOBAL TECH OPERATIONS LLC