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Chip mounter, pasting mounting correction device and correction method thereof

A calibration device and placement machine technology, which is applied to the assembly of printed circuits with electric components, positioning of circuit board tools, etc., can solve problems such as non-compliance with standards and failure to place chips normally, and achieve improved production efficiency, easy operation and Effects of maintenance and reduction of conditions of use

Inactive Publication Date: 2015-06-24
SHENZHEN BROMAKE AUTOMATION EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a chip mounter, a mounting correction device and a correction method thereof, aiming to solve the problem that the chip mounter in the prior art cannot be mounted normally or the chip that is pasted is not corrected due to the correction device. Material does not meet the standard problem

Method used

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  • Chip mounter, pasting mounting correction device and correction method thereof
  • Chip mounter, pasting mounting correction device and correction method thereof
  • Chip mounter, pasting mounting correction device and correction method thereof

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Embodiment Construction

[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0025] Such as Figure 1 to Figure 6 As shown, it is a preferred embodiment of the present invention, a placement machine, including a placement correction device 1, a first suction nozzle 2, a second suction nozzle 3, a first suction nozzle elevating mechanism 4 and a second suction nozzle Lifting mechanism 5. Wherein, the placement calibration device 1 includes a motion platform 10 , a calibration mechanism 11 and a moving mechanism 12 for moving the motion platform 10 .

[0026] See figure 2 and image 3 , the moving platform 10 is provided with a sheet mat...

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Abstract

The invention is applicable to the technical field of pasting equipment and provides a chip mounter, a pasting mounting correction device and a correction method thereof. The pasting mounting correction device comprises motion platforms and correction mechanisms, each motion platform is provided with a sheet stock containing part, at least three sliding grooves are formed in the periphery of the sheet stock containing part on each motion platform, and one end of each sliding groove is close to the corresponding sheet stock containing part. Each correction mechanism is provided with sliding blocks of the same number with that of the sliding grooves, and each sliding block can slide along the corresponding sliding groove in a reciprocating mode to conduct correction on sheet stock. After the correction is finished, second suction nozzles of the chip mounter suck up the sheet stock and paste the sheet stock onto a product. The chip mounter and the pasting mounting correction device have the advantages that the structure is simple, and the operation and maintenance are easy. The chip mounter can still finish chip pasting work even if the positional deviation of the sheet stock is large, the requirement of the chip mouter for the sheet stock is lowered, the use condition of the chip mounter is lowered, the application range is increased, the production efficiency is improved, and the production cost is lowered.

Description

technical field [0001] The invention belongs to the technical field of placement equipment, and in particular relates to a placement machine, a placement correction device and a correction method thereof. Background technique [0002] The placement machine sucks the sheet material where the auxiliary material is placed through the suction nozzle, and sticks it on the product. Due to the deviation of the position or angle of the placement of the sheet material, if the position of the sheet material is not corrected, the suction nozzle will directly paste the sheet material with the position deviation on the product. The current placement machine, such as mobile phone accessories The placement machine does not have a mechanism for correcting the two-dimensional position of the chip. These placement machines cannot work normally when using a chip with a relatively large position deviation, or the chip that is pasted does not meet the standard. Contents of the invention [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30
CPCH05K3/0008H05K3/30
Inventor 王周龙朱泰丁
Owner SHENZHEN BROMAKE AUTOMATION EQUIP
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