Sputtering thin film soil pressure sensor

Abstract

The invention discloses a sputter film type soil pressure sensor which comprises an elastic sensitive element, an annular thin-walled cylinder, a circular film type strain gauge, a lead connection plate and an upper sealing cover. The elastic sensitive element is fixedly connected with the lower end of the annular thin-walled cylinder, the circular film type strain gauge is arranged in the annular thin-walled cylinder and clings to the inner surface of the elastic sensitive element, the lead connection plate is arranged in the annular thin-walled cylinder and is positioned above the circular film type strain gauge, electrode points of the circular film type strain gauge are connected with connection weld points on the lower surface of the lead connection plates by gold wire leads, a connection weld point on the upper surface of the lead connection plate is connected with an ordinary signal lead by a signal lead-out wire, and the upper sealing cover is fixedly connected with the upper end of the annular thin-walled cylinder. The sputter film type soil pressure sensor has the advantages that the circular film type strain gauge and the annular thin-walled cylinder are in separate structural designs, accordingly, adhesive agents can be omitted during production, instability of the performance of the sensor due to influence of environmental temperatures on the adhesive agents can be eliminated, and the reliability of the sensor can be improved.

Description

technical field [0001] The invention relates to a pressure sensor, in particular to a sputtering film type soil pressure sensor. Background technique [0002] With the rapid development of the modern construction industry, the construction of a large number of subways, tunnels, high-speed rail, bridges, high-rise buildings, hydropower stations and other facilities and the prevention and control of geological disasters all require prediction and analysis of soil mechanical properties and stability, which requires accurate Measures the effective stress of the soil. [0003] The ultra-thin round button soil pressure sensor on the existing market is made elastic by bonding strain gauges on the surface of the round membrane in the round groove of the overall structure of the round groove fixed around the elastic round membrane. Sensitive components are bonded to the upper cover with special glue, and the lead wires of the strain gauge are drawn out through the lead hole on the s...

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Problems solved by technology

[0006] 3. The thickness of the small handle where the lead wire transfer point of the strain gauge is located is the superposition of the thickness of the solder joint and the waterproof glue, and its height exceeds the total thickness of the sensor. When testing the soil stress, it will affect the real force of the sensor test, thereby affecting the sensor test value. authenticity

[0007] 4. It needs to be manually bonded and produced, which is greatly affected by human factors and has poor consistency. At the same time, this structure and production process can only be produced by a single piece, which is not easy to produce in batches. The production efficiency is low and the yield is low.

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