Electronic device rework method
An electronic device and heavy industry technology, applied in electrical components, electrical components and other directions, can solve the problems of reducing product yield, reducing processing efficiency, workpiece damage, etc., to achieve the effect of improving product yield and improving processing efficiency
Inactive Publication Date: 2015-07-01
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
However, since the material composition of the colloid is generally epoxy resin, its adhesion is very strong after curing, and it is difficult to disassemble each module
It is difficult to manually disassemble each module, which leads to a decrease in processing efficiency; and when manually disassembled, it is easy to cause damage to the workpiece and reduce the product yield
Method used
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[0012] see figure 2 , the reworking method of the electronic device 100 in this embodiment is used to disassemble the electronic device 100 , the electronic device 100 includes the colloid 30 , and the first workpiece 10 and the second workpiece 20 adhered together by the colloid 30 . The first workpiece 10 includes a substrate 12 , a functional component 14 and a shielding layer 16 . The substrate 12 is light-transmissive, allowing infrared rays to pass through. The substrate 12 has a first surface 121 and a second surface 123 oppositely disposed. Both the functional element 14 and the shielding layer 16 are formed on the second surface 123 of the substrate 12 , and the shielding layer 16 is disposed around the functional element 14 and covers the substrate 12 together with the functional element 14 . The glue 30 is coated on the shielding layer 16 for bonding the first workpiece 10 and the second workpiece 20 . When the functional part 14 fails, the first workpiece 10 an...
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Abstract
An electronic device rework method is used for disassembling a first workpiece and a second workpiece bonded together via a colloid. The first workpiece comprises an infrared transmitting substrate and a function piece formed on the substrate, and the colloid and the function piece are arranged in an interval or adjacent mode. The electronic device rework method comprises the following steps: a reflection protection layer is formed on one side, deviated from the function piece, of the substrate, and the reflection protection layer fully covers the position corresponding to the function piece on the substrate; the infrared light is used for heating and softening the colloid to enable viscosity of the colloid to be reduced, and the protection layer can reflect the infrared light to protect the function piece; the remaining reflection protection layer is removed; and the first workpiece and the second workpiece are disassembled. According to the rework method, the efficiency is high, and workpieces are not damaged.
Description
technical field [0001] The invention relates to a method for reworking an electronic device, in particular to a method for disassembling and reworking an electronic device. Background technique [0002] In order to meet the needs of miniaturization and light weight of electronic products, in the assembly of electronic products, each module of the product is generally assembled by adhesive fixing, for example, the touch display module and the housing are assembled together by adhesive. When a product is poorly assembled or fails after use, it is often necessary to disassemble each module and remove the adhesive for rework. However, since the material composition of the colloid is generally epoxy resin, its adhesion is very strong after curing, and it is difficult to disassemble each module. It is difficult to manually disassemble each module, which leads to a decrease in processing efficiency; and when manually disassembled, it is easy to cause damage to the workpiece and re...
Claims
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Inventor 张明仁葛智逵邱郁婷
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD