Electronic device and housing thereof

A technology for electronic devices and casings, applied in electronic switches, sealed casings, electrical components, etc., can solve problems such as low assembly yield, complicated assembly process, and affecting operating functions, so as to ensure service life and reliability, and simplify the manufacturing process Steps, the effect of improving assembly yield

Inactive Publication Date: 2015-07-15
HTC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above configuration method will cause excessive waste of internal configuration space of the portable electronic device, and its assembly process is also relatively complicated, so there are problems such as high manufacturing difficulty, long manufacturing man-hours, and low assembly yield.
On the other hand, dust and moisture can easily enter the interior of the electronic device through the gap between the key and the external opening, which greatly reduces the life of the electronic component and affects its normal operation.

Method used

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  • Electronic device and housing thereof
  • Electronic device and housing thereof
  • Electronic device and housing thereof

Examples

Experimental program
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Embodiment Construction

[0042] figure 1 is a schematic diagram of an electronic device according to an embodiment of the present application. figure 2 yes figure 1 A schematic diagram of the enclosure. Figure 3A yes figure 2 A partial enlarged view of the shell. Please refer to Figure 1 to Figure 3A , in this embodiment, the electronic device 50 includes a body 60 and a housing 100 . The casing 100 covers the body 60 . The housing 100 includes a housing 110 and sensing components 120 and 130 . The housing 110 has button portions 112 and 114 . The sensing component 120 includes a first wire 122 and two first contacts 124 , and the sensing component 130 includes a first wire 132 and two first contacts 134 . The first wires 122 and 132 are disposed on the inner surface of the housing 110 , and the first wires 122 and 132 respectively form the strain sensing patterns 122 a and 132 a on the key portions 112 and 114 . The first contacts 124 and 134 are disposed on the inner surface of the casi...

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PUM

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Abstract

The invention discloses an electronic device and a housing thereof. The housing comprises a housing body and an induction component, wherein the housing body is provided with a key part; the induction component comprises a first lead and two first contacts; the first lead is arranged on the internal surface of the housing body, and forms a strain induction pattern at the key part; and the first contacts are arranged on the internal surface of the housing body, and connected with the two ends of the first lead respectively. The strain induction pattern is suitable for allowing a resistance value to change along with deformation of the key part to generate an electrical signal.

Description

technical field [0001] The present application relates to a casing and an electronic device thereof, and in particular to an electronic device with a seamless button design and a casing thereof. Background technique [0002] In recent years, technology products mostly focus on mobility and functionality. Therefore, portable electronic devices such as personal digital assistants (personal digital assistants, PDAs), smart mobile phones (smart mobile phones), tablet computers (tablet PCs) and Products such as notebook computers (notebook, NB) have become the mainstream of today's consumption. [0003] Generally speaking, the portable electronic device is usually equipped with a button on the casing, and a switch element corresponding to the button is provided in the casing. The button and the switch element are coupled to each other, and the switch element is controlled by pressing the button to achieve functions such as power switch, volume adjustment, video recording, or scr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K5/06H03K17/96
Inventor 钟政涵宛兆峰
Owner HTC CORP
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