Chip thermal pressure detection method, system and thermal compression packaging control system
A detection method, thermal pressure technology, applied in the direction of measuring device, force/torque/work measuring instrument, semiconductor/solid-state device manufacturing, etc., can solve the problem that the thermal pressure system cannot achieve thermal pressure stability and other problems
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[0057] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. The description herein is only used to explain the present invention when referring to specific examples, and does not limit the present invention.
[0058] like figure 1 As shown, the overall process of the chip hot-press packaging control method of the present invention is as follows: first, the image of the indentation is collected, and then the characteristics of the indentation are extracted, and then the deviation between the indentation characteristics and the target value is calculated according to the indentation evaluation method, and the indentation evaluation It is to evaluate whether the hot pressing pressure is appropriate through the deviation of the indentation width: the indentation in the image is in the form of a ring, and the width of the ring re...
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