Silk-screen product plugging method and tool

A technology for screen-printing plug holes and products, which is applied to the formation of electrical connection of printing components, etc., can solve the problems of plugging holes and can not guarantee product reliability, etc., and achieves the effect of avoiding plugging foaming and improving plugging ability.

Active Publication Date: 2018-04-20
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Whether the plug hole is full and whether it is easy to generate air bubbles in the hole is not only related to the product thickness-to-diameter ratio, hole wall roughness, hole density, screen printing equipment capabilities, and screen printing parameters, but also affected by the viscosity of the ink, especially the pore size. For small and thick products, it is difficult to plug the hole with one knife, and the hole cannot be filled with resin, so the reliability of the product cannot be guaranteed; on the other hand, due to the high viscosity of the ink, the ink enters the hole instantly Affected by shear attraction, plugging and blistering are prone to occur

Method used

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  • Silk-screen product plugging method and tool

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Embodiment Construction

[0019] The present invention will be described below in conjunction with the drawings.

[0020] The basic idea of ​​the present invention is that the present invention proposes a method of plugging holes by heating the ink to reduce the viscosity. In this method, the ink is slightly warmed up, and a low-power heater is installed on the ink return knife of the screen printing machine to maintain the ink at a considerable temperature. If the silk screen plugging is carried out under certain conditions, the viscosity of the ink will decrease after heating up, and it will be easier to penetrate the hole wall, which can greatly improve the plugging ability and avoid the occurrence of plugging bubbles.

[0021] A method for plugging holes of silk screen products, which includes a heating step and a heat preservation step.

[0022] In the pre-heating step, the ink is heated up to reduce its viscosity by half compared to that before heating. The ink heating temperature is between 33 ...

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PUM

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Abstract

Provided is a via filling method for a silk-screen printing product, comprising: a pre-heating step in which ink is heated so as to increase the temperature in order to reduce the viscosity thereof to half the viscosity before heating, and a heat preservation step in which the ink is heated and heat-preserved by an ink reclaiming knife in the process of screen printing via filling until the screen printing via filling is finished. After the temperature of the ink is increased, the viscosity is reduced, so that the wall of a via can be more easily penetrated. Thus, the via filling capability can be greatly enhanced, the occurrence of foaming during via filling can be avoided, the physicochemical properties of the resin are not affected, and the product quality is also not affected.

Description

【Technical field】 [0001] The invention relates to the field of silk screen printing, in particular to a method for plugging holes of silk screen printing products. 【Background technique】 [0002] The printed board is also called a printed circuit board or a printed circuit board (Printed Circuit Board, PCB). The electrical connection between the component pins is realized through the printed wires, pads and metallized vias on the printed board. . IC carrier board is an important branch of PCB and the development direction of PCB. At present, the manufacture of IC substrates is mainly based on the build-up method, which is called "Bulidup" in the industry. The build-up method first overlaps several circuit layers and interlayer insulation layers, and heats and presses them into one. Then form a circuit layer on the interlayer insulating layer and set necessary via holes. However, in addition to metallization, via holes must be further filled by filling. Common filling meth...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40
CPCH05K3/40
Inventor 刘成勇谢添华李志东
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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