Cloud server mainboard, cloud server and realization method thereof

A technology of cloud server and main board, applied in the field of cloud server, can solve the problems of high height and impossibility

Inactive Publication Date: 2015-08-05
DAWNING CLOUD COMPUTING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present application proposes a cloud server main board, cloud server and its implementation method, in order to solve the technical problem that in the prior art, a method of inserting multiple CPU cards into one substrate leads to a higher height and cannot be realized in a height of 1U

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  • Cloud server mainboard, cloud server and realization method thereof
  • Cloud server mainboard, cloud server and realization method thereof
  • Cloud server mainboard, cloud server and realization method thereof

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Embodiment Construction

[0021] In order to make the technical solutions and advantages of the present application clearer, the exemplary embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all implementations. Exhaustive list of examples. And in the case of no conflict, the embodiments in this description and the features in the embodiments can be combined with each other.

[0022] Aiming at the deficiencies of the prior art, the embodiment of the present application proposes a cloud server mainboard, a cloud server and an implementation method thereof, which will be described below.

[0023] figure 1 A schematic structural diagram of a cloud server mainboard according to an embodiment of the present application is shown. As shown in the figure, multiple system-on-chips (SOC, System on Chip) are integrated on the cloud serve...

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Abstract

The application provides a cloud server mainboard, a cloud server and a realization method thereof. A plurality of SOCs (system on chip) are integrated on the cloud server mainboard, each SOC is externally connected with a DIMM (dual in-line memory module) and a SATA (serial advanced technology attachement) connector; each SOC is respectively interconnected with a PCIe (peripheral component interconnect express) Switch chip and a GbE (Gigabit Ethernet) Switch chip, the PCIe Switch chip and the GbE Switch chip are interconnected with a backboard connector, the backboard connector is interconnected with a management system, the management system is interconnected with a PHY chip, the PHY chip is respectively interconnected with the GbE Switch chip and a RJ45 interface. Through the adoption of the scheme provided by the embodiment of the application, the plurality of SOCs are integrated on the cloud server mainboard, and the PCIe Switch and the GbE Switch chip are integrated to realize internal interconnection and external interconnection, thereby realizing the condition that the cloud server mainboard can be placed in a chassis in low height to be normally used without majorly changing the existing cabinet.

Description

technical field [0001] The present application relates to the technical field of cloud servers, and in particular to a cloud server motherboard, a cloud server and an implementation method thereof. Background technique [0002] Generally, cloud servers need to integrate multiple central processing unit (CPU) chips in a standard chassis. At present, it is often used to insert multiple CPU cards on one substrate, and each CPU card integrates a CPU chip. [0003] Using the method of inserting multiple CPU cards on one substrate, its main disadvantage is the high height, which cannot be realized in 1U height, and generally requires 2U or 4U height. When the height of the existing cabinet is not enough, it is necessary to make larger changes to the existing cabinet. [0004] The deficiencies in the prior art are: [0005] The method of inserting multiple CPU cards into one substrate leads to a higher height, which cannot be realized in a 1U height. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): G06F1/16G06F1/18
Inventor 孙瑛琪闵敏
Owner DAWNING CLOUD COMPUTING TECH CO LTD
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