Preparation process of high temperature electrothermal film
A preparation process and technology of electrothermal film, applied in electrothermal devices, ohmic resistance heating, electrical components, etc., can solve the problems of high melting point, low resistance, high hardness, etc., and achieve high thermal conversion rate, compact structure, and stable crystalline performance. Effect
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Embodiment 1
[0013] S1. Take 100ml of alcohol and place it in a conical flask, heat it to 80°C, add 17.529g of tin tetrachloride and 0.57g of antimony trichloride to seal it, and stir at a constant temperature of 80°C for one hour;
[0014] S2. After standing the solution obtained in step S1 for 2 hours, use a glue-spreader on the quartz substrate to evenly coat 15 layers at a speed of 5.0kr / min. After the coating is completed, naturally cool down to room temperature to deposit colloid;
[0015] S3. The quartz substrate obtained in step S2 is placed in an atmosphere high-temperature furnace at 450° C. and sintered for 4 hours to obtain a finished product.
Embodiment 2
[0017] Take 100ml of alcohol and put it in a conical flask, heat it to 80°C, add 17.529g of tin tetrachloride and 0.57g of antimony trichloride to seal it, and stir at a constant temperature of 80°C for one hour;
[0018] S2. After the solution obtained in step S1 is allowed to stand for 2 hours, 20 layers of glue are evenly coated on the quartz substrate using a glue homogenizer at a speed of 5.0kr / min. After the coating is completed, the temperature is naturally cooled to room temperature to deposit colloid;
[0019] S3. The quartz substrate obtained in step S2 is placed in an atmosphere high-temperature furnace at 450° C. and sintered for 4 hours to obtain a finished product.
Embodiment 3
[0021] Take 100ml of alcohol and put it in a conical flask, heat it to 80°C, add 17.529g of tin tetrachloride and 0.57g of antimony trichloride to seal it, and stir at a constant temperature of 80°C for one hour;
[0022] S2. After standing the solution obtained in step S1 for 2 hours, use a glue-smoother on the quartz substrate to evenly coat 18 layers at a speed of 5.0kr / min. After the coating is completed, naturally cool down to room temperature to deposit colloid;
[0023] S3. The quartz substrate obtained in step S2 is placed in an atmosphere high-temperature furnace at 450° C. and sintered for 4 hours to obtain a finished product.
[0024] After testing, the XRD patterns of the thin film structures obtained in Examples 1-3 at a temperature of 450°C are as follows: figure 1 shown.
[0025] The invention can prepare thin films under lower temperature conditions, can accurately control the amount of dopants, and can prepare SnO with a larger area. 2 It is incomparable wit...
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