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Electronic equipment and circuit board connection method

A technology of electronic equipment and circuit boards, which is applied in the electronic field and can solve the problems of increasing the size of circuit boards and unfavorable development of miniaturization of electronic equipment.

Active Publication Date: 2015-08-19
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present application provides a method for connecting electronic equipment and circuit boards, which solves the problem that in the prior art, when one circuit board needs to be connected to two circuit boards at the same time, it is necessary to arrange connectors at two different positions of the circuit board, so that The increase in size of the circuit board is a technical problem that is not conducive to the development of miniaturization of electronic equipment

Method used

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  • Electronic equipment and circuit board connection method
  • Electronic equipment and circuit board connection method
  • Electronic equipment and circuit board connection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Such as figure 1 As shown, it is a schematic structural diagram of an electronic device 100 in a preferred embodiment of the present application. The electronic device 100 may be any device including a circuit board, such as a computer, a mobile phone, a television, a refrigerator, an air conditioner, a server, and the like. The electronic device 100 includes a first circuit board 10 , a second circuit board 20 , a third circuit board 30 , a first anisotropic conductive adhesive film 40 and a second anisotropic conductive adhesive film 50 .

[0039] The first circuit board 10 includes first pins 11 .

[0040] The second circuit board 20 includes a second pin 22 .

[0041] The third circuit board 30 is arranged between the first circuit board 10 and the second circuit board 20, and the third circuit board 30 is provided with a third pin 33 and the third pin 33 The position corresponds to and opposite to the fourth pin 34 .

[0042] Specifically, the first pin 11, the...

Embodiment 2

[0062] Such as figure 2 As shown, it is a schematic structural diagram of an electronic device 200 in another preferred embodiment of the present application; the difference between the electronic device 200 and the electronic device 100 is only that: the first anisotropic conductive adhesive film 40 and the second anisotropic conductive adhesive The lengths of the films 50 are different, the relative positions of the first circuit board 10 and the third circuit board 30 are different, and the relative positions of the second circuit board 20 and the third circuit board 30 are different.

[0063] Specifically, in this embodiment, the lengths of the first anisotropic conductive adhesive film 40 and the second anisotropic conductive adhesive film 50 are longer than the lengths of the first anisotropic conductive adhesive film 40 and the second anisotropic conductive adhesive film 50 in Example 1. The length of the second anisotropic conductive adhesive film 50, due to the incre...

Embodiment 3

[0065] Such as image 3 As shown, it is a flow chart of another preferred embodiment of the circuit board connection method of the present application. The circuit board connection method includes the following steps:

[0066] Step 310, arrange the first pin of the first circuit board opposite to the third pin of the third circuit board, and arrange the second pin of the second circuit board opposite to the fourth pin of the third circuit board, so The third pin corresponds to the position of the fourth pin and is arranged oppositely on the third circuit board;

[0067] Step 320, placing the first anisotropic conductive adhesive film between the first pin and the third pin, and placing a second anisotropic conductive film between the second pin and the fourth pin Anisotropic conductive film;

[0068] Step 330, hot pressing the first circuit board, the first anisotropic conductive adhesive film, the third circuit board, the second anisotropic conductive adhesive film and the...

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Abstract

The invention discloses electronic equipment and a circuit board connection method. The electronic equipment comprises a first circuit board, a second circuit board, a third circuit board, a first anisotropic conductive adhesive film and a second anisotropic conductive adhesive film. The first circuit board comprises a first pin. The second circuit board comprises a second pin. The third circuit board is arranged between the first circuit board and the second circuit board. The third circuit board is provided with a third pin and a fourth pin corresponding to and opposite to the third pin in position. The first anisotropic conductive adhesive film is arranged between the first pin and the third pin and is used for connecting the first pin with the third pin. The second anisotropic conductive adhesive film is arranged between the second pin and the fourth pin and is used for connecting the second pin with the fourth pin.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic device and a circuit board connection method. Background technique [0002] Two or more circuit boards are usually arranged in an electronic device, and the circuit boards may be printed circuit boards or flexible circuit boards, or one may be a flexible circuit board and the other may be a printed circuit board. When assembling the electronic device, it is usually necessary to electrically connect two or more circuit boards. [0003] In the prior art, the two or more circuit boards are usually electrically connected in the following manner. Firstly, a connector is provided on the circuit board, and then, the connectors on the two circuit boards are connected by a cable or the like, so that the two circuit boards are electrically connected. If a circuit board needs to be electrically connected to two circuit boards at the same time, it is necessary to set conn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/51H01R12/59
Inventor 段霆
Owner LENOVO (BEIJING) LTD
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