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Radiator stamping part structure

A technology of stamping parts and heat sinks, which is applied in the field of heat sink stamping parts structure, can solve problems such as ineffective heat dissipation of heat sinks, poor materials of notebook heat sinks, and abnormal heat dissipation of computers, etc., achieving good use value and reasonable appearance design , the effect of high-efficiency radiator work

Inactive Publication Date: 2015-09-16
WUXI TIANLI HARDWARE SPRING FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there are many deficiencies in the fasteners, and the material of the notebook radiator is poor
At present, non-brand products usually use plastic materials, which not only have poor thermal conductivity, but also have unreasonable shape design and unsightly appearance.
Many radiators have no obvious heat dissipation effect, which makes the computer unable to dissipate heat normally and reduces the service life of the computer. Therefore, a radiator stamping part structure is proposed to solve the above problems

Method used

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  • Radiator stamping part structure
  • Radiator stamping part structure
  • Radiator stamping part structure

Examples

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Effect test

Embodiment

[0024] Example: such as Figure 1-3 As shown, a radiator stamping part structure of the present invention includes a ventilation plate 1, a heat dissipation belt 2, a tripod 3, a foot hole 4, a bottom plate 5, a bolt 6, a square hole 7, a motor slot 8, a ventilation hole 9, and a wind blade Slots 10 and cooling nets 11; a heat dissipation belt 2 is arranged between the ventilation plate 1 and the bottom plate 5, and a tripod 3 is installed at the bottom of the bottom plate 5; foot holes 4 are arranged on the surface of the tripod 3; inside the ventilation board 1 square hole 7, and the ventilation plate 1 is tightly connected with the base plate 5 by bolts 6; a cooling net 11 is installed inside the base plate 5, and a ventilation hole 9 is arranged inside the cooling net 11; a motor slot 8 is installed inside the ventilation hole 9; Wind vane slots 10 are installed around the motor slot 8 .

[0025] As a preferred technical solution of the present invention, the four sides o...

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Abstract

The invention provides a radiator stamping part structure. The radiator stamping part structure comprises a ventilating plate, a heat dissipating strip, foot stands, foot holes, a bottom plate, bolts, a square hole, motor grooves, vent holes, wind blade grooves and heat dissipating meshes; the heat dissipating strip is arranged between the ventilating plate and the bottom plate, the foot stands are installed at the bottom end of the bottom plate, foot holes are formed in the surfaces of the foot stands, the square hole is formed in the ventilating plate, the ventilating plate is tightly connected with the bottom plate through the bolts, the heat dissipating meshes are installed in the bottom plate, the vent holes are formed in the heat dissipating meshes, the motor grooves are formed in the vent holes, and the wind blade grooves are formed around the motor grooves. The radiator stamping part structure is compact in structure and capable of being assembled and disassembled effectively, and the four motor grooves formed internally can effectively help a computer to dissipate heat; as the foot holes are formed in the foot stands, materials are reduced, the production cost is saved, and a radiator can be hung by the foot holes through a supporting rod and therefore can be used in many places.

Description

technical field [0001] The invention relates to a stamping part structure, in particular to a stamping part structure of a radiator, and belongs to the technical field of stamping parts. Background technique [0002] The internal space of the notebook is small, and the high performance and high load operation of each component will bring too much heat. In winter, the heat can be properly exported through the cooling design of the notebook, and it will not have a great impact on the notebook. However, in summer, as the ambient temperature rises, the heat dissipation design of the notebook is not enough to meet the temperature requirements of the notebook, so the heat dissipation of the notebook in summer will become the key to determine whether it can run smoothly. Heat dissipation performance depends on the material There are more and more types of notebook radiators, but there has also been a mixed situation, and the heat dissipation performance depends on the material...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 张建忠
Owner WUXI TIANLI HARDWARE SPRING FACTORY
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