A double-sided assembled integrated circuit

Abstract

The invention discloses a double-sided assembled integrated circuit, which comprises a casing (1), pins (4) are arranged on both sides of the bottom of the casing (1), a substrate (5) is arranged inside the casing (1), and the casing ( The top of 1) is provided with an encapsulation cover plate (3), characterized in that steps (2) are arranged around the inner wall of the housing (1), and the edges around the bottom surface of the substrate (5) are bonded to the steps (2) ), the substrate (5) divides the inner cavity of the housing (1) into an upper cavity and a lower cavity; the bottom surface of the substrate (5) is also provided with an insulating layer (9) that cooperates with the step (2). ), the top surface and the bottom surface of the substrate (5) are respectively provided with electrical components (6); the step (2) is also provided with a vertical notch (8), and the notch (8) connects the upper cavity and the lower cavity Connected; Abandon the traditional method of bonding the entire bottom surface of the substrate to the shell, and set steps around the inner wall of the shell, so that the edges around the substrate are bonded to the steps. The top and bottom surfaces of the substrate can be equipped with assembled electrical components to achieve dual The surface is assembled at the same time, which greatly improves the utilization rate of the substrate and the integration level of the integrated circuit.

Description

technical field [0001] The invention relates to the field of microelectronic product manufacturing, in particular to a double-sided assembled integrated circuit. Background technique [0002] It is well known that microelectronics technology is an important way to realize miniaturization, multi-function and high reliability of electronic systems, and has been widely used in various fields in recent years. For hybrid integrated circuits, at present, electrical components such as bare chips and chip resistors are generally assembled on one side of the substrate, and then the other side is bonded to the base of the housing, which can only be assembled on one side of the substrate. The assembly of the substrate uses The rate is low, which is not conducive to improving the integration level of the circuit. Contents of the invention [0003] The purpose of the present invention is to provide a double-sided assembly integrated circuit, which can realize component assembly on bot...

AI Technical Summary

Problems solved by technology

For hybrid integrated circuits, at present, electrical components such as bare chips and chip resistors are generally assembled on one side of the substrate, and then the other side is bonded to the base of the housing, which can only be assembled on one side of the substrate. The assembly of the substrate utilizes The rate is low, which is not conducive to improving the integration of the circuit

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