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Unevenness detecting device

一种检测装置、被加工物的技术，应用在测量装置、采用光学装置、图像数据处理等方向，能够解决无法详细验证加工状态、无法验证磨削痕迹凹凸状态等问题

Active Publication Date: 2015-10-14
DISCO CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, the image taken by the imaging means is a two-dimensional image of the surface, and the two-dimensional image of the predetermined depth, the three-dimensional image of the depth and cross-sectional shape of the cutting groove and the laser processing groove, the state of chips, etc. cannot be detected from the surface. 3D images, there is a problem that the processing status cannot be verified in detail
[0013] In addition, there is a problem that the unevenness of the grinding marks cannot be verified in the grinding device

Method used

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Examples

Experimental program
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Embodiment Construction

[0031] Hereinafter, preferred embodiments of the unevenness detection device will be described in more detail with reference to the drawings.

[0032] figure 1 A perspective view showing a laser processing facility as a processing facility provided with an unevenness detection device. figure 1 The shown laser processing equipment 1 has a stationary base 2, which is disposed on the stationary base 2 so as to be movable in a processing feed direction (X-axis direction) indicated by an arrow X, and holds a workpiece to be processed. The workpiece holding mechanism 3 and the laser beam irradiating unit 4 that is disposed on the stationary base 2 and serves as a processing member, that is, a laser beam irradiating member.

[0033] The above-mentioned workpiece holding mechanism 3 has: a pair of guide rails 31, 31, which are arranged in parallel on the stationary base 2 along the X-axis direction indicated by the arrow X; It is arranged on the guide rails 31 and 31 in a manner of ...

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Abstract

An unevenness detecting device includes: a pulsed illuminating light source emitting light having a predetermined wavelength range; a first condensing lens condensing return light reflected by a workpiece held on a chuck table and passed through a chromatic aberration lens and a half-silvered mirror; a mask disposed at the position of a focal point of the first condensing lens, the mask passing only the condensed return light; a diffraction grating performing light separation so as to correspond to the wavelengths of the return light; a second condensing lens condensing the return light resulting from the light separation by the diffraction grating; and an imaging element disposed at the position of a focal point of the second condensing lens.

Description

technical field [0001] The present invention relates to an unevenness detection device for detecting the machining state of laser-machined grooves and cutting grooves, etc., processed on workpieces such as wafers, and the unevenness of grinding traces on the machined surface after grinding. . Background technique [0002] In the manufacturing process of semiconductor devices, the surface of a substantially disk-shaped wafer is divided into a plurality of regions by dividing lines arranged in a grid pattern, and devices such as ICs and LSIs are formed on the divided regions. Then, after the back surface of the wafer is ground to a predetermined thickness, it is cut along planned dividing lines to divide the region where the device is formed, and each device is manufactured. [0003] A grinding apparatus for grinding the back surface of a wafer has: a chuck table holding a wafer; a grinding member having a grinding wheel for grinding a wafer held on the chuck table; and a thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/70B24B7/22
CPCG06T7/0004G01B11/306G06K9/46G06K9/52G06K2009/4666G01N21/9501B24B7/228B23K2101/40
Inventor 能丸圭司
Owner DISCO CORP