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Cooling device and air conditioner comprising cooling device

A technology for cooling devices and air conditioners, applied in the fields of cooling devices and air conditioners, can solve the problems of scattered bubbles, turbulent flow, and heat transfer barriers of bubbles, and achieve the effects of rapid and uniform heat dissipation and improvement of heat conduction efficiency.

Inactive Publication Date: 2015-10-14
DAIKIN IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the field of air conditioning, the diameter of the pipeline for refrigerant flow is usually thinner, and the smaller the diameter, the faster the flow velocity of the liquid, and the faster the flow velocity, the easier it is to generate turbulent flow, which will cause the air bubbles to scatter in the pipeline. There will be air bubbles that will block the heat transfer
Therefore, even with Figure 9 The structure shown will also affect the heat dissipation effect of the power components

Method used

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  • Cooling device and air conditioner comprising cooling device
  • Cooling device and air conditioner comprising cooling device
  • Cooling device and air conditioner comprising cooling device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 2

[0063] The air conditioner according to Embodiment 2 of the present invention is basically the same in structure as the air conditioner according to Embodiment 1 described above, except for a part of the structure of the cooling device. Here, the same reference numerals are assigned to the same components as those in Embodiment 1, and the differences are centered. Refer to Figure 4 Be explained.

[0064] In Embodiment 1 above, the upstream pipe section 511 , the downstream pipe section 512 and the container 52 all extend in the horizontal direction (that is, the diameter direction of the container 52 is parallel to the vertical direction G).

[0065] In contrast, in this embodiment, the upstream pipe section 511 and the downstream pipe section 512 extend along the horizontal direction, but the container 52' ​​extends along the vertical direction G (that is, the diameter direction of the container 52' ​​is perpendicular to the vertical direction G), Moreover, the height of th...

Embodiment approach 3

[0068] The air conditioner according to Embodiment 3 of the present invention is basically the same in structure as the air conditioner according to Embodiment 2 described above, except for a part of the structure of the cooling device. Here, the same reference signs are assigned to the same components as those in Embodiment 2 above, and the differences are centered. Refer to Figure 5 Be explained.

[0069] In Embodiment 2 described above, the upstream-side pipe section 511 and the downstream-side pipe section 512 are provided on the upper side wall of the container 52' ​​in an opposing manner.

[0070] On the contrary, in this embodiment, the upstream side pipe section 511 and the downstream side pipe section 512 are disposed on the lower side wall of the container 52'' in an opposite manner, and other structures are the same as those of the second embodiment above.

[0071] According to this embodiment, basically the same effect as that of the second embodiment described a...

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Abstract

The invention discloses a cooling device and an air conditioner comprising the cooling device. The cooling device comprises a pipeline and a heat conduction part. The cooling device is simple in structure, and the condition that gaseous refrigerants are gathered on the inner wall of a pipeline or a container close to the side of a power element can be reduced; and it is ensured that refrigerants in contact with the inner wall of the pipeline or the inner wall of the container are liquid-state refrigerants, so that the heat dissipation efficiency is improved, and the rapid even heat dissipating effect on the power element is achieved accordingly. The cooling device is used for the air conditioner. The cooling device comprises the pipeline and the heat conduction part. The refrigerants are allowed to flow in the pipeline from the upstream side to the downstream side, and the heat conduction part is in contact with the pipeline; the container is arranged in the pipeline, and the height of at least one section in sections obtained by slicing the container in the vertical direction is larger than the diameter of the pipeline; and the heat conduction part is in contact with the bottom of the outer wall of the container or is arranged on the outer wall of the portion, closer to the downstream side than the position of the container, of the pipeline.

Description

technical field [0001] The present invention relates to a cooling device and an air conditioner including the cooling device. Background technique [0002] In the field of air conditioners, there is currently a technology to dissipate heat from power components through the liquid refrigerant in the refrigeration cycle. When using this heat dissipation technology, in order to improve the heat dissipation capability of the power components, it can be considered to improve the heat dissipation efficiency (that is, the thermal conductivity), or to consider reducing the temperature of the refrigerant used for cooling. [0003] When a method of lowering the temperature of the refrigerant for cooling is considered, it can be realized by using a low-temperature liquid refrigerant after subcooling the heat exchanger. However, this method will cause the temperature of the liquid refrigerant to be below the dew point of the outdoor ambient temperature (the temperature that causes cond...

Claims

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Application Information

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IPC IPC(8): F24F1/24
CPCF24F1/24
Inventor 冈本敦石原洋纪
Owner DAIKIN IND LTD