a device for cooling
A technology of heat dissipation plate and width, applied in the field of heat dissipation devices, can solve problems such as cracking of reflective silicon, and achieve the effects of prolonging service life, reasonable design and convenient disassembly
Active Publication Date: 2018-03-16
天津众晶半导体材料有限公司
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Problems solved by technology
Because high-energy infrared light has high heat, the reflective silicon surface used to reflect the infrared light will inevitably accumulate high heat. If the heat cannot be dissipated in time, it is easy to cause the reflective silicon to break
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[0020] Such as Figure 1-3 As shown, a device for heat dissipation includes an upper heat dissipation plate 1 and a lower heat dissipation plate 2 connected to each other, the material of the upper heat dissipation plate 1 and the lower heat dissipation plate 2 is silicon, and the upper heat dissipation plate 1 and the lower heat dissipation plate 2 are both Quadrangular structure, the left side and right side of the upper cooling plate 1 are arranged in parallel, the upper side and the lower side of the upper cooling plate 1 are inclined, the width of the upper cooling plate is 47.0mm, and the height is 7.0mm; the left side and the right side of the lower cooling plate 2 are parallel Setting, the upper side and the lower side of the lower cooling plate 2 are inclined, the angle between the upper side of the lower cooling plate 2 and the vertical direction is 53.3°, the angle between the lower side of the lower cooling plate 2 and the vertical direction is 70.6°, and the lower ...
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The invention provides a device for heat dissipation, belonging to the technical field of heat dissipation equipment, comprising an upper heat dissipation plate and a lower heat dissipation plate connected to each other, a protrusion is provided on the upper surface of the lower heat dissipation plate, and a There is a gap between the upper heat dissipation plate and the protrusion, the left and right sides of the upper heat dissipation plate are arranged in parallel, the upper and lower sides of the upper heat dissipation plate are inclined, the left and right sides of the lower heat dissipation plate are arranged in parallel, and the lower heat dissipation plate is arranged in parallel. The upper side and the lower side of the plate are inclined, and the upper heat dissipation plate is provided with an upper groove, the upper groove runs through the upper heat dissipation plate, and the lower heat dissipation plate is provided with a lower groove, and the lower groove runs through the lower heat dissipation plate. The invention has simple structure, reasonable design, convenient installation and disassembly, high heat dissipation rate, can dissipate the heat on the reflective silicon surface in time, has high heat dissipation rate, and can prolong the service life of the reflective silicon.
Description
technical field [0001] The invention relates to the technical field of heat dissipation equipment, in particular to a device for heat dissipation. Background technique [0002] Materials used to make infrared optics are known to be brittle, such as silicon. Whether they are single crystal or polycrystalline, no matter whether the crystal grains are large or small, they are not as strong as glass and cannot withstand long-term exposure to high-energy infrared light. Because high-energy infrared light has high heat, the reflective silicon surface used to reflect the infrared light will inevitably accumulate high heat. If the heat cannot be dissipated in time, it will easily cause the reflective silicon to break. Therefore, it is necessary to develop a device for dissipating heat from the surface of the reflective silicon in time, which has a high heat dissipation rate and can prolong the service life of the reflective silicon. Contents of the invention [0003] The problem...
Claims
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IPC IPC(8): H01L23/36H05K7/20
Inventor 薛佳伟薛佳勇王海军
Owner 天津众晶半导体材料有限公司