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PCB having good heat-dissipation performance and mobile terminal applied therewith

A heat dissipation performance, mobile terminal technology, applied in circuit thermal devices, circuit thermal components, printed circuit components, etc., can solve the problems of PCB heat dissipation, such as very large restrictions on heat dissipation, great heat dissipation influence, and heat dissipation obstacles, and reach product users. Good experience, improve heat dissipation efficiency, improve heat dissipation effect

Active Publication Date: 2015-10-21
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the temperature rise of mobile phones is solved by heat dissipation and heat-conducting materials. Due to the limitation of wiring and space on the PCB, the heat dissipation of the PCB is very limited. In fact, the heat dissipation of the PCB has a great impact on the temperature rise of the whole machine. At present, the PCB The design is that the copper layer is isolated from the copper layer by using FR4 grade base material. This material has high temperature tolerance and has a great influence on heat dissipation.
Therefore, the use of this material has a certain hindering effect on the heat dissipation of the PCB, and the heat dissipation capability can only be enhanced by drilling holes and laying copper on the wires.

Method used

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  • PCB having good heat-dissipation performance and mobile terminal applied therewith
  • PCB having good heat-dissipation performance and mobile terminal applied therewith
  • PCB having good heat-dissipation performance and mobile terminal applied therewith

Examples

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Embodiment 1

[0024] Such as figure 1 As shown, in this embodiment, a PCB with good heat dissipation performance according to the present invention includes a PCB substrate, the PCB substrate includes a layer of substrate body 100, and a surface with a A thermally conductive layer 200 with good thermal conductivity and insulation performance, the thermally conductive layer 200 is in close contact with the substrate body 100, and the other surface of the PCB substrate opposite to the surface on which the thermally conductive layer 200 is provided is provided with a circuit pattern 300 .

Embodiment 2

[0026] Such as figure 2 As shown, in this embodiment, a PCB with good heat dissipation performance according to the present invention includes a PCB substrate, and the PCB substrate includes a layer of substrate body 100, and both sides of the PCB substrate are provided with The heat conduction layer 200 has good heat conduction and insulation properties, the heat conduction layer 200 is in close contact with the substrate body 100 , and a circuit pattern 300 is arranged on one side surface of the PCB substrate and outside the heat conduction layer 200 .

Embodiment 3

[0028] Such as image 3 As shown, in this embodiment, a PCB with good heat dissipation performance according to the present invention includes a PCB substrate, and the PCB substrate includes a layer of substrate body 100, and both sides of the PCB substrate are provided with The heat conduction layer 200 has good heat conduction and insulation properties, the heat conduction layer 200 is in close contact with the substrate body 100 , and circuit patterns 300 are arranged on both sides of the PCB substrate and outside the heat conduction layer 200 .

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Abstract

The invention discloses a PCB having a good heat-dissipation performance. The PCB comprises a PCB substrate. The PCB substrate comprises a substrate body. At least one side surface of the PCB substrate is provided with a heat-conducting layer having good heat conduction and insulating performances. The heat-conducting layer is tightly contacted with the substrate body. The other surface, opposite to the side surface provided with the heat-conducting layer, of the PCB substrate is provided with a circuit pattern. The heat-conducting layer having the good heat conduction and insulating performances is filled in the PCB, thereby improving heat-dissipation performance of the PCB; and heat from heating elements is diffused to the whole surface of the PCB through a heat conduction material, thereby improving heat-dissipation area and improving heat-dissipation efficiency. The invention also discloses a mobile terminal which adopts a main plate made from the PCB above, so that heat-dissipation performance is good and user experience of the product is good.

Description

technical field [0001] The invention relates to the technical field of PCB products, in particular to a PCB with good heat dissipation performance and a mobile terminal using the same. Background technique [0002] At present, the temperature rise of mobile phones is solved by heat dissipation and heat-conducting materials. Due to the limitation of wiring and space on the PCB, the heat dissipation of the PCB is very limited. In fact, the heat dissipation of the PCB has a great impact on the temperature rise of the whole machine. At present, the PCB The design is that the copper layer is isolated from the copper layer by using FR4 grade base material. This material has high temperature tolerance and has a great influence on heat dissipation. Therefore, the use of this material has a certain hindering effect on the heat dissipation of the PCB, and the heat dissipation capability can only be enhanced by drilling holes and laying copper on the wires. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0209H05K2201/06
Inventor 李路路
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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