Slide back pressure shut-off valve

Abstract

The present invention relates to a back pressure shut-off valve used in piping for maintaining a constant pressure in semiconductor manufacturing processes such as semiconductors and LCDs, or chemical product manufacturing processes, or for maintaining the flow of fluids such as gases in a positive direction. The system can be prevented from shutting off quickly when the system suddenly occurs atmospheric inflow or fluid reverse flow phenomenon, more specifically, it relates to the following slide type back pressure shut-off valve: it includes: a valve body, which consists of a fluid inflow part, a fluid The outflow part and the fluid passage space are formed; the transfer body is equipped with a shut-off plate that shuts off the fluid flow when the fluid is back-pressurized, and the transfer body is horizontal to the fluid passage space when the back pressure is cut off. Movement; and the transfer body moving unit, which moves the transfer body horizontally. Usually, since the fluid space passage of the valve has no obstructions and does not hinder the flow of fluid like a straight pipe, when back pressure occurs in the piping, the transfer body Move horizontally to the shut-off position, in which the shut-off plate installed on the transfer body floats to shut off the flow of fluid, so that the process can run smoothly even when powder occurs.

Description

technical field [0001] The present invention relates to a back pressure shut-off valve used in piping for maintaining a constant pressure in semiconductor manufacturing processes such as semiconductors and LCDs, or chemical product manufacturing processes, or for maintaining the flow of fluids such as gases in a positive direction. The system can be prevented from shutting off quickly when the system suddenly occurs atmospheric inflow or fluid reverse flow phenomenon, more specifically, it relates to the following slide type back pressure shut-off valve: it includes: a valve body, which consists of a fluid inflow part, a fluid The outflow part and the fluid passage space are formed; the transfer body is equipped with a shut-off plate that shuts off the fluid flow when the fluid is back-pressurized, and the transfer body is horizontal to the fluid passage space when the back pressure is cut off. Movement; and the transfer body moving unit, which moves the transfer body horizont...

AI Technical Summary

Problems solved by technology

The semiconductor manufacturing equipment performs basic processes such as deposition or etching in a vacuum state (or a very low pressure state). Particles are generated on the above, causing a large loss to the basic processing

[0003] In order to prevent this problem, a back pressure shutoff valve is used between the vacuum chamber and the vacuum pump. As shown in Patent No. 706661, the shutoff plate that performs the back pressure shutoff function in the conventional backpressure shutoff valve relies on gravity. The structure of the action is a meander in which the flow path is bent more than once, so it is very fragile when the instantaneous flow velocity increases and the fluid flows

[0004] Moreover, in the manufacturing process of semiconductors, etc., the chemical vapor deposition (CVD: Chemical Vapor Deposition) process is a process in which a reaction gas is sprayed in a vacuum state and then a film is coated on the wafer. After the process is completed, the decomposed silicon dioxide ( SiO 2 ) and alumina (Al 2 o 3 ) such as particulate matter (hereinafter referred to as "powder (powder)") will occur a lot, because the shut-off plate of the back pressure shut-off valve is always exposed to the flow path, so the powder will cause the shut-off plate Deformation affects repeated action and accurate sealing under accurate pressure when shutting off

[0005] Also, if the powder is stacked on the shut-off plate, due to the presence of powder between the shut-off plate and the seal at the time of back pressure shutoff, it cannot be sealed accurately, so leakage occurs and the back pressure shutoff function cannot be performed.

[0006] Moreover, the powder stacked on the shut-off plate will cause a change in the quality of the shut-off plate, which will increase the rising pressure of the shut-off plate at the time of shut-off, making it impossible for the shut-off plate to float, resulting in failure to shut-off and return. serious problem with pressure

[0007] Moreover, the general-purpose general gate valve (gate valve) cannot perform the back pressure shut-off function. Although its structure does not have the meander shape of the tortuous flow path, there is no problem of instantaneous flow rate increase and fluid flow vulnerability, but the powder is long When time is stacked on the internal drive part and the shut-off plate, powder will exist between the shut-off plate and the seal, resulting in inaccurate sealing, resulting in leakage and failure to perform the shut-off function

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