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Laser treatment apparatus and method

A technology of laser processing and equipment, which is applied in the field of laser processing equipment and can solve problems such as substrate pattern restrictions

Active Publication Date: 2018-04-20
CHARM ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the pattern of the substrate or the substrate on which the repair process is performed may be limited

Method used

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  • Laser treatment apparatus and method
  • Laser treatment apparatus and method
  • Laser treatment apparatus and method

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Embodiment Construction

[0034] Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the dimensions of layers and regions are exaggerated for clarity of illustration. Like reference numerals denote like elements in the drawings.

[0035] figure 1 is a schematic diagram illustrating a laser processing apparatus according to an exemplary embodiment. figure 2 is a view illustrating a structure of a laser processing apparatus according to an exemplary embodiment. image 3 (a) and (b) are views illustrating the adjustment of the magnification of the photographing unit according to the substrate processing work according to the exe...

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Abstract

The present invention relates to a laser processing device and a processing method thereof. The laser processing device comprise: a laser unit for generating and dividing a laser beam; a scanner unit providing a route through which the laser beam passes, and equipped with a plurality of scanners for adjusting a traveling direction of the laser beam; a guide unit for selectively guiding the divided laser beams to the scanners, and arranged between the laser unit and the scanner unit; an irradiation unit for irradiating the laser beam, which has passed the scanner unit, to a substrate; and a photographing unit for photographing the substrate. Accordingly, the substrate can be monitored and the wavelength of a laser can be selectively used.

Description

technical field [0001] The present invention relates to a laser processing apparatus and method, and more particularly, to a laser processing apparatus and method capable of monitoring a substrate and selectively using a wavelength of laser light. Background technique [0002] Generally, various patterns such as circuit patterns are formed on a semiconductor wafer or a flat panel display such as a liquid crystal display (LCD). For example, a flat panel display includes an array substrate, a counter substrate, a liquid crystal layer, and the like. A plurality of pixel electrodes arranged in a matrix configuration, a plurality of scanning lines arranged along rows of the plurality of pixel electrodes, and a plurality of scanning lines arranged along columns of the plurality of scanning lines are formed on the array substrate among these components. signal lines. [0003] Meanwhile, defects such as overlapping of electrical signal lines may occur during the manufacturing proc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/402B23K26/38
CPCH01L22/12
Inventor 金俊来李瑾行池泳洙
Owner CHARM ENG CO LTD