Method and device for improving surface properties of copper alloy

A technology of surface properties and copper alloys, which is applied in the field of improving the surface properties of copper alloys and copper contract surface treatment, can solve the problems that copper alloy surface treatment technology cannot fundamentally improve copper alloys, etc., and achieve surface quality protection, simple process methods, The effect of improving processing efficiency

Inactive Publication Date: 2017-05-31
HUANGSHAN UNIV
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  • Application Information

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Problems solved by technology

[0003] The purpose of this invention is to solve the problem that the existing copper alloy surface treatment technology cannot fundamentally improve the surface properties of copper alloys, to invent a method for improving the surface properties of copper alloys, and to provide a set of corresponding complete processing devices to increase the surface properties of copper alloys. The depth of the modified layer can be greatly improved in terms of wear resistance and corrosion resistance

Method used

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  • Method and device for improving surface properties of copper alloy
  • Method and device for improving surface properties of copper alloy
  • Method and device for improving surface properties of copper alloy

Examples

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Embodiment 1

[0031] Such as Figure 1-3 shown.

[0032] A method for improving the surface properties of copper alloys. First, place workpieces 1-6 on the workbench 1-3 in the heating mechanism 1, close the furnace door 1-5, and then vacuumize the heating chamber at 1-4. 1-1 Vacuumize, the vacuum degree is 95~98%, and then connect the heating wire 1-2 to heat the workpiece 1-6. When the temperature measuring instrument in the heating chamber shows that the temperature reaches 400~500°C, stop heating and open the furnace door 1-5, the workpiece 1-6 is placed on the 3-7 position of the workbench 3-2 of the surface strengthening mechanism 3 by the manipulator 2, and then the switch of the surface strengthening mechanism 3 is turned on, and the head of the bed installed on the pillar 3-3 3-4 drives the clamping part 3-5 to rotate, and the bed head 3-4 can move up and down with the pillar 3-3 to adjust the proper position, and the stirring head 3-6 installed on the clamping part 3-5 also rotates...

Embodiment 2

[0034] Such as Figure 1-3 shown.

[0035] A device for improving the surface properties of copper alloys, which is mainly composed of a heating mechanism 1, a first manipulator 2, a surface strengthening mechanism 3, a second manipulator 4 and a surface grinding mechanism 5, such as figure 1 As shown; the first manipulator 2 is located between the heating mechanism 1 and the surface strengthening mechanism 3, and is used to take out the workpiece heated by the heating mechanism 1 and send it into the surface strengthening mechanism 3 for surface strengthening under the thermal state; the second The manipulator 4 is located between the surface strengthening mechanism 3 and the surface grinding mechanism 5, and is used to send the workpiece after surface strengthening of the surface strengthening mechanism 3 into the surface grinding mechanism 5 for final surface treatment; the heating mechanism 1 is mainly composed of a heating chamber 1- 1. The heating wire 1-2 and the heati...

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Abstract

The invention discloses a method and device for improving copper alloy surface performance. The method and device are characterized in that the copper alloy surface is heated in a vacuum manner, stirring and surface extruding are carried out on the heated copper alloy surface through the stirring friction surface machining technology, a hardening layer is formed to improve the performance of the copper alloy surface, and meanwhile the stirring and milling composite machining method is achieved through a specially-manufactured stirring head, so that the machining quality of the surface is guaranteed while the machining efficiency is greatly improved. Finally, a workpiece with the machined surface is ground on a grinding mechanism, and the smooth copper alloy surface is obtained.

Description

technical field [0001] The invention relates to a surface treatment technology, in particular to a copper contract surface treatment technology, in particular to a method and a device for improving the surface performance of copper alloys. Background technique [0002] At present, copper alloys are widely used in industrial production, such as various valve bodies, ship propellers, various impeller blades and so on. However, the environment encountered by copper alloys in these applications is very harsh. For example, various valve bodies may be used in high temperature, high pressure, or acid-alkaline areas. In different locations for a long time, such as severe cold areas, high temperature areas, and areas with different atmospheric acidity and alkalinity, the surface will be greatly affected in the end. For these reasons, many researchers began to study how to improve the surface properties of copper alloys. Some scholars used coating treatment on the surface of copper a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P23/04
CPCB23P23/04
Inventor 宋娓娓汪建利汪洪峰孙月圣鲍雷
Owner HUANGSHAN UNIV
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