Encapsulation method of card seat and mobile terminal

A technology of mobile terminals and packaging methods, which is applied in the direction of assembling printed circuits with electrical components, telephone structures, etc., can solve problems such as poor reliability, scrapped main boards, and desoldering of card holders, so as to achieve good reliability, avoid scrapping, The effect of enhancing binding force

Inactive Publication Date: 2015-11-04
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With this package structure, if the force of plugging and unplugging the card is too large or the card is reversed, it is easy to cause the card socket to be desoldered, the motherboard is scrapped, and the reliability is not good.

Method used

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  • Encapsulation method of card seat and mobile terminal
  • Encapsulation method of card seat and mobile terminal
  • Encapsulation method of card seat and mobile terminal

Examples

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Embodiment Construction

[0019] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0020] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may be a central element at the same time. When an element is said to be "connected to" another element, it can be directly connected to the other element or an intermediate element may also be present.

[0021] It should also be noted that the directional terms such as left, right, up and down in the embodiments of the present invention are only relative concepts or refer to the normal use state of the product, and should not be co...

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Abstract

The invention is applied to the technical field of card seat encapsulation, and discloses an encapsulation method of a card seat and a mobile terminal. The encapsulation method comprises the steps as follows: preparing a card seat with plug pins and a circuit board with plating through holes, inserting the plug pins of the card seat in the plating through holes, and welding the plug pins of the card seat to the plating through holes. The mobile terminal comprises a mobile terminal main body and the circuit board arranged in the mobile terminal main body. The card seat is connected on the circuit board; the circuit board is provided with the plating through holes; the card seat is provided with the plug pins which are inserted in the plating through holes and are welded to the plating through holes. According to the encapsulation method of the card seat and the mobile terminal provided by the invention, the plug pins of the card seat could be inserted and weld in the plating through holes so that the card seat is not easy to be unsoldered even when the force for inserting and pulling the card is large or the card needs to be forcibly pulled under the condition that the card is inversely inserted to avoid the scrapping of a master board with excellent reliability.

Description

Technical field [0001] The invention belongs to the technical field of card socket packaging, and in particular relates to a card socket packaging method and a mobile terminal. Background technique [0002] In current mobile terminals such as mobile phones, the SIM (Subscriber Identity Module) card socket, T-Flash (memory card) card socket, SIM card and T-Flash card two-in-one card sockets used in their motherboards are packaged The pads are all mounted through SMD (Surface Mounted Devices) pads, or SMD pads + Non-PTH (Non PLATING Through Hole) positioning holes. With this kind of packaging structure, if the card insertion and removal force is too large or the card needs to be forced to be inserted and removed when the card is installed reversely, it is easy to cause the card socket to be soldered, the motherboard is scrapped, and the reliability is poor. Summary of the invention [0003] The purpose of the present invention is to overcome the above-mentioned shortcomings of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02H05K3/34
Inventor 胡在成
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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