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32results about How to "Not easy to desolder" patented technology

Battery grouping structure and battery pack comprising same

The invention discloses a battery grouping structure which comprises two fixing plates and a connecting plate, wherein the fixing plates can be arranged at two ends of a battery; the connecting plate can be arranged on one side surface, which deviates from the battery, of the fixing plates; at least one part of the connecting plate is conductive; fixing holes used for limiting the ends of the battery therein are formed in the fixing plates; through holes used for exposing the ends of the battery on one side surface, which deviates from the battery, of the fixing plates are formed in the bottoms of the fixing holes, so that the ends of the battery can penetrate through the through holes and are welded with the connecting plate; and a limiting groove used for limiting the welding position is formed in a position, which corresponds to the through hole, of the connecting plate. According to the battery grouping structure, the battery is clamped between two fixing plates, and a good effect of supporting the battery is achieved; and moreover, the through holes are formed in the bottoms of the fixing holes, so that the ends of the battery are exposed, the battery is fixed with the connecting plate in a welding mode, series-parallel connection among multiple batteries is realized by virtue of the connecting plate, and the grouping structure is fewer in parts, easy to operate and suitable for batch production.
Owner:HUBEI JINQUAN NEW MATERIALS CO LTD

Method for welding ultra-pure copper target material and back plate

The invention discloses a method for welding an ultra-pure copper target material and a back plate. The welding method comprises the steps that coating of a welding surface of the back plate with a thread is performed; then the back plate and the ultra-pure copper target material are assembled; the assembled ultra-pure copper target material and back plate are put into a sheath; the sheath is sealed and vacuumized; the vacuumized sheath is subjected to hot isostatic pressing treatment; and welding of the ultra-pure copper target material and the back plate is completed. According to the method, as the structure of the welding surface of the back plate is improved, threaded protrusions can be embedded into the target material, and then a combination effect of the target material and the back plate is enhanced, then diffusivity of a coating film is utilized, and the target material and the welding surface of the back plate are fully covered, so that the welding combination degree betweenthe target material and the back plate is improved, and the welding strength is high; the coating film is placed on the back plate, so that completeness of the coating film is ensured during welding,and damage caused to the coating film by the threaded protrusions is avoided. According to the welding method, a hot isostatic pressing process is adopted to control the size of crystal grains of thetarget material, so that the target material meets application requirements of a super-large-scale integrated circuit.
Owner:KONFOONG MATERIALS INTERNATIONAL CO LTD

Encapsulation method of card seat and mobile terminal

The invention is applied to the technical field of card seat encapsulation, and discloses an encapsulation method of a card seat and a mobile terminal. The encapsulation method comprises the steps as follows: preparing a card seat with plug pins and a circuit board with plating through holes, inserting the plug pins of the card seat in the plating through holes, and welding the plug pins of the card seat to the plating through holes. The mobile terminal comprises a mobile terminal main body and the circuit board arranged in the mobile terminal main body. The card seat is connected on the circuit board; the circuit board is provided with the plating through holes; the card seat is provided with the plug pins which are inserted in the plating through holes and are welded to the plating through holes. According to the encapsulation method of the card seat and the mobile terminal provided by the invention, the plug pins of the card seat could be inserted and weld in the plating through holes so that the card seat is not easy to be unsoldered even when the force for inserting and pulling the card is large or the card needs to be forcibly pulled under the condition that the card is inversely inserted to avoid the scrapping of a master board with excellent reliability.
Owner:GUANGDONG OPPO MOBILE TELECOMM CORP LTD

Multiple-chip array type chip-on-board (COB) inversely-installed eutectic packaging structure and method

The invention relates to a multiple-chip array type chip-on-board (COB) inversely-installed eutectic packaging structure and method. The multiple-chip array type COB inversely-installed eutectic packaging structure comprises a ceramic heat-radiating substrate, a fluorescent powder and silica gel mixed packaging layer and light-emitting diode (LED) chips, wherein an insulating layer is arranged on the upper surface of the ceramic heat-radiating substrate, a circuit conductor layer is arranged above the insulating layer, and multiple LED chip connecting units are installed on the upper side of the ceramic heat-radiating substrate. Each LED chip connecting unit consists of a bonding layer, an LED chip and a gold wire shared by thermo-sonic keys, wherein the positive pole ends of the chips are in eutectic bonding with the bonding layers and connected with the circuit conductor layer, and the negative pole ends of the LED chips are connected with one end of the circuit conductor layer on the front side of the substrate through the gold wires. The multiple-chip array type COB inversely-installed eutectic packaging structure and method has the advantages of being excellent in heat-radiating effect and capable of avoiding the problems including chip defects or reduced luminous efficiency and the like caused by the different expansion degree of the chip and the substrate with heat, facilitating wire arrangement, reducing bonding temperature, improving the reliability performance and solving the problems of false welding and unsoldering of wires.
Owner:GUANGDONG JINYUAN LIGHTING TECH

Scaffold production process

The invention discloses a scaffold production process, and relates to the technical field of scaffolds. According to the technical scheme, the scaffold production process comprises the following stepsthat S1, a steel plate is taken, and blank parts are obtained by performing cutting or stamping on the steel plate, wherein two opposite sides, in the width direction, of each blank part are closed sides, and notches are formed in the closed sides; S2, the blank parts are curled through a plate rolling machine, so that the closed sides are close to each other, and the blank parts are curled intoa C shape; S3, two curled blank parts are taken, so that C-shaped openings of the two blank parts are opposite to each other, and cross rods are erected between the two blank parts; S4, a net plate isplaced on the cross rods, and the net plate extends into the C-shaped openings of the two blank parts; and S5, the blank parts are pressed through a press machine, so that the closed sides press thenet plate, and the notches are buckled to limit the cross rods. According to the scaffold production process, the fixing strength of the net plate is high, and the net plate is not prone to sealing off or damage when being stressed; and the production process has few requirements on the types of raw materials, and the utilization rate of the raw materials is improved.
Owner:上海森大机械制造有限公司

Low-cost high-heat-dissipation intelligent function module

The invention discloses a low-cost high-heat-dissipation intelligent function module which comprises a DBC substrate, the DBC substrate is sequentially connected with a copper wiring layer, a ceramic layer and a copper heat dissipation layer from top to bottom, and the copper wiring layer comprises a first copper wiring layer arranged above one end of the ceramic layer and a second copper wiring layer arranged above the other end of the ceramic layer; the function module further comprises a first side pin, and one end of the first side pin is electrically connected with a first bonding wire arranged on the first copper wiring layer; the function module further comprises an IC chip, the IC chip is welded on the first copper wiring layer, a first welding flux layer is arranged between the IC chip and the first copper wiring layer, and the IC chip is welded on the first copper wiring layer. The problems of insufficient welding, high cost and relatively poor heat dissipation performance of pins of the intelligent function module are solved, the purposes that the pins of the intelligent function module are not easy to deweld and stable in welding are realized, the heat dissipation performance is good, the quality of the intelligent function module is effectively guaranteed, and meanwhile the manufacturing cost is effectively reduced.
Owner:志豪微电子(惠州)有限公司

An electroplating process

The invention relates to an electroplating technology which mainly comprises a front treatment process, an electrocoppering process and an aftertreatment groove. The front treatment process mainly comprises the steps of ultrasonic oil removal, electrolytic degreasing, washing, activating and washing; a front treatment groove is divided into three parts including an ultrasonic oil removal groove, an electrolytic degreasing groove and an activating groove, and the three parts independently exist in closed space; and the electrocoppering process mainly comprises copper pre-plating, copper plating, recovering and washing; and an aftertreatment process mainly comprises the steps of drying and oil immersion. The electroplating technology is mainly characterized in that a steel strip is in an S-shaped walking direction in the overall process, and the cost of the steel strip is about one third of the cost of a production line. A closed treatment groove can conduct emergency treatment, meanwhile, the phosphorus content in sulfate copper electroplating is extremely small, plating layer bonding is more compact, a manufactured Bundy pipe is not prone to desoldering, resources can be effectively saved, and safety of persons is protected; and a cyanide copper plating solution is used for conducting copper preplating firstly, and therefore adhesiveness of the plating layer on the steel strip is good, and meanwhile, the electroplating technology meets the current environment-friendly production principle.
Owner:SHANDONG JIANZHU UNIV

Friction welding method for target material assembly

The invention relates to the technical field of welding, and discloses a friction welding method of a target material assembly, according to the friction welding method, heat generated by friction between a target material rotating at a high speed and a back plate is used for locally melting a first boss and a second boss, and a compact solid-phase welding seam is formed under extrusion of a welding tool. According to the friction welding method, the welding bonding layer is formed through melting, the bonding strength is higher than that of brazing indium, the high-temperature resistance is better, and desoldering is not prone to occurring; compared with electron beam welding, the welding area of the first boss and the second boss is larger, namely, the metallurgical bonding area is larger, and the overall strength is higher; compared with diffusion welding, the friction welding method is shorter in consumed time, inert gas or other working conditions do not need to be adopted for protection, and the cost is low; and secondly, the friction welding method is small in friction force, low in equipment requirement, low in energy consumption and short in welding time consumption, and small-area contact friction is not prone to causing overall deformation of the target material or the back plate.
Owner:先导薄膜材料(安徽)有限公司

Guardrail for nursery stock maintenance

The invention discloses a guardrail for nursery stock maintenance, and relates to the technical field of nursery stock maintenance and planting. The guardrail comprises supporting columns and baffle plates. One baffle plate is fixed between every two adjacent supporting columns through four connecting pieces and a plurality of screws. Each connecting piece comprises a cylinder body matched with the supporting columns. The opening end of the cylinder body is fixedly provided with a first pipe body, and the outer side of the first pipe body is rotationally matched with a second cylinder body. Athird pipe body is fixed at one end of the first pipe body. Two first clamping plates are arranged on the outer peripheral side of the cylinder body in parallel. A plurality of first fixing holes anda plurality of first fastening holes are formed in the first clamping plates. Two second clamping plates are arranged on the outer peripheral side of the second cylinder body in parallel. A pluralityof second fixing holes and a plurality of second fastening holes are formed in the second clamping plates. The first fixing holes, the first fastening holes, the second fixing holes and the second fastening holes are all threaded holes. According to the invention, the nursery stock protection guardrail is formed by assembling the supporting columns, the baffle plates and the connecting pieces. Therefore, the problems that an existing nursery stock protection guardrail is heavy in structure and the desoldering phenomenon of the existing nursery stock protection guardrail often occurs during thefixation process can be solved.
Owner:合肥草木蕃景生态科技有限公司

Hanging fixture for gasket galvanization

The invention relates to the technical field of galvanization, in particular to a hanging fixture for gasket galvanization. The hanging fixture comprises a bottom plate, a galvanizing bath and a sedimentation mechanism; fixing screws penetrate through four surfaces of the bottom plate in a threaded manner, the bottom plate can fix an equipment body through the fixing screws, side plates are fixedly arranged at the two sides of the bottom plate, a top plate is fixedly arranged at the side, away from the bottom plate, of each side plate, and the bottom plate, the side plates and the top plate form an equipment body supporting framework; the galvanizing bath is fixedly mounted on the bottom plate; and the two ends of the sedimentation mechanism are rotationally installed on the side plates, the power input end of the sedimentation mechanism is arranged outside the side plates, the power output end of the sedimentation mechanism is fixedly provided with a moving mechanism, a clamp is fixedly arranged on the moving mechanism, the sedimentation mechanism can drive the clamp through the moving mechanism to enter the galvanizing bath for galvanizing, and the moving mechanism is used for moving the clamp for gasket feeding and discharging. According to the hanging fixture for gasket galvanization, the feeding and discharging processes can be greatly simplified, the gasket clamp is not prone to desoldering, the service life is long, operation is easy, and the practicability is high.
Owner:ANHUI HONGYUAN IRON TOWER

Machining process of high-wear-resistance alloy cutter

The invention discloses a machining process of a high-wear-resistance alloy cutter. The machining process comprises the following steps that (1), the requirements of different cutters, including the thickness of a cutter body and the thickness of a blade peak of the cutter body during normal work are determined so as to prepare the cutter body and an alloy strip with corresponding thicknesses; (2), the cutter body is machined, specifically, a strip-shaped groove is formed in the side, facing the blade peak, of one side of a blade part of the cutter body in the length direction of the cutter body, and two cutter body base layers capable of clamping an alloy layer are formed on the blade part of the cutter body; (3), the alloy strip in the strip-shaped groove is brazed to form the alloy layer, so that the blade part forms a layered structure which is formed by tightly and firmly connecting the alloy strip clamped by the two cutter body base layers; and (4), shaping and trimming the cutter body base layers are carried out to enable the side edges of the alloy strip to protrude out of the two cutter body base layers to form blade peaks and enable the cutter body base layers on the twosides of the alloy strip to form smooth blade parts. By utilizing the process to machine the alloy cutter, the steps are simpler and easy to implement, the machined alloy cutter is sharp in blade, good in abrasion resistance, long in service life and high in production efficiency in the using process, and the mechanical energy consumption is effectively reduced.
Owner:DONGE LIYUAN MACHINERY KNIFE
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