Card holder packaging method and mobile terminal

A technology of mobile terminals and packaging methods, which is applied in the direction of assembling printed circuits with electrical components, telephone structures, etc., can solve problems such as poor reliability, desoldering of card holders, scrapping of main boards, etc., to achieve good reliability, avoid scrapping, The effect of enhanced binding

Inactive Publication Date: 2018-05-29
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With this package structure, if the force of plugging and unplugging the card is too large or the card is reversed, it is easy to cause the card socket to be desoldered, the motherboard is scrapped, and the reliability is not good.

Method used

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  • Card holder packaging method and mobile terminal
  • Card holder packaging method and mobile terminal
  • Card holder packaging method and mobile terminal

Examples

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0020] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element at the same time. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0021] It should also be noted that the orientation terms such as left, right, up, and down in the embodiments of the present invention are only relative concepts or refer to the normal use state of the product, and should ...

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Abstract

The invention is applicable to the technical field of card socket packaging, and discloses a card socket packaging method and a mobile terminal. The encapsulation method comprises the steps of preparing a socket with pins and a circuit board with metallized holes, inserting the pins of the socket into the metallized holes, and welding the pins of the socket to the metallization Hole slot. The mobile terminal includes a mobile terminal body and a circuit board arranged in the mobile terminal body, the circuit board is connected with a card holder, the circuit board is provided with a metallized hole groove, and the card holder has a The slot is metallized and welded to the pin of the metallized slot. The card socket packaging method and mobile terminal provided by the present invention can insert the pins of the card socket into the metallized hole, and weld the pins of the card socket to the metallized hole, even if the card is inserted and pulled out. When the force is too strong or the card is reversed, it is not easy to cause the card holder to be desoldered, avoiding scrapping of the motherboard, and good reliability.

Description

technical field [0001] The invention belongs to the technical field of card socket packaging, and in particular relates to a card socket packaging method and a mobile terminal. Background technique [0002] Currently mobile terminals such as mobile phones, SIM (Subscriber Identity Module, customer identification module) card holders, T-Flash (memory card) card holders, SIM card and T-Flash card two-in-one card holders used in the motherboard, the package The pads are all mounted pads through SMD (Surface Mounted Devices, surface mount devices), or SMD pads + Non-PTH (Non PLATING Through Hole, non-sinking copper holes) positioning holes. With this package structure, if the card is inserted or pulled out with too much force or the card is reversed, it will easily lead to desoldering of the card socket, scrapping of the main board, and poor reliability. Contents of the invention [0003] The object of the present invention is to overcome the shortcomings of the above-mention...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04M1/02H05K3/34
Inventor 胡在成
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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