Low-cost high-heat-dissipation intelligent function module
A technology with intelligent functions and high heat dissipation, applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve problems such as poor heat dissipation performance, high cost, and false soldering of pins, and achieve stable welding and good heat dissipation , the effect of quality assurance
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[0034] The present invention will be described in further detail below to facilitate the understanding of the present invention, and will be described in more detail below.
[0035] Such as Figure 1-2 As shown in the embodiment, an embodiment of the present invention provides a low-cost high cooling intelligent function module, including:
[0036] DBC substrate 1, the DBC substrate 1 is sequentially connected to the top to bottom, the ceramic layer 12, the copper heat safety layer 13, the copper trace layer 11 including the first side of the ceramic layer 12 The copper trace layer 111 is provided at the second copper trace layer 112 above the other end of the ceramic layer 12;
[0037] The first side pin 2, one end of the first side pin 2 is electrically connected to the first copper trace layer 111;
[0038] IC chip 3, the IC chip 3 is welded to the first copper trace layer 111, and the IC chip 3 is provided with a first solder layer 71 between the first copper t...
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