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Electronic connector assembly electric plating process

An electronic connector and electroplating process technology, applied in the field of electronic connector electroplating process, can solve the problems of low comprehensive production efficiency, large one-time investment, waste of financial and material resources, etc. Effect

Inactive Publication Date: 2018-07-24
JIANGSU AOGUANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the original continuous copper plating of steel strips, multiple copper plating tanks, auxiliary tanks and other auxiliary equipment are required. The continuous copper plating production line of steel strips is 80 meters long and occupies a large area. The steel strip production line is about 20,000 yuan per meter , the one-time investment is too large, the overall production efficiency is low, and a large number of staff are required for maintenance operations, resulting in a waste of financial and material resources

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] An electroplating process for electronic connectors, which sequentially includes pretreatment before electroplating, an electroplating process, and post-plating treatment steps, wherein the pretreatment before electroplating includes the steps of degreasing, washing, activation, and washing; the electroplating process includes nickel plating, Matte pure tin process step; the post-plating treatment includes a drying process.

[0015] Preferably, the degreasing adopts ultrasonic degreasing and electrolytic degreasing, the temperature of ultrasonic degreasing is 55°C, the ultrasonic current is greater than 0.2A, and the current of electrolytic degreasing is 25A.

[0016] Preferably, NiCl2 is used for the activation, and the activation current is 35A.

[0017] Preferably, the treatment tank for the pretreatment before electroplating includes an ultrasonic degreasing tank, an electrolytic degreasing tank, and an activation tank, and the three parts are independent enclosed s...

Embodiment 2

[0022] An electroplating process for electronic connectors, which sequentially includes pretreatment before electroplating, an electroplating process, and post-plating treatment steps, wherein the pretreatment before electroplating includes the steps of degreasing, washing, activation, and washing; the electroplating process includes nickel plating, Matte pure tin process step; the post-plating treatment includes a drying process.

[0023] Preferably, the degreasing adopts ultrasonic degreasing and electrolytic degreasing, the ultrasonic degreasing temperature is 65°C, the ultrasonic current is greater than 0.2A, and the electrolytic degreasing current is 35A.

[0024] Preferably, NiCl2 is used for the activation, and the activation current is 45A.

[0025] Preferably, the treatment tank for the pretreatment before electroplating includes an ultrasonic degreasing tank, an electrolytic degreasing tank, and an activation tank, and the three parts are independent enclosed spaces....

Embodiment 3

[0030] An electroplating process for electronic connectors, which sequentially includes pretreatment before electroplating, an electroplating process, and post-plating treatment steps, wherein the pretreatment before electroplating includes the steps of degreasing, washing, activation, and washing; the electroplating process includes nickel plating, Matte pure tin process step; the post-plating treatment includes a drying process.

[0031] Preferably, the degreasing adopts ultrasonic degreasing and electrolytic degreasing, the temperature of ultrasonic degreasing is 60°C, the ultrasonic current is greater than 0.2A, and the current of electrolytic degreasing is 30A.

[0032] Preferably, NiCl2 is used for the activation, and the activation current is 40A.

[0033] Preferably, the treatment tank for the pretreatment before electroplating includes an ultrasonic degreasing tank, an electrolytic degreasing tank, and an activation tank, and the three parts are independently enclosed...

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PUM

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Abstract

The invention discloses an electronic connector assembly electric plating process, which sequentially comprises the steps of electric plating pretreatment, electric plating process and an electric plating post treatment process, wherein the electric plating pretreatment comprises the process steps of deoiling, water washing, activation and water washing. The electric plating process comprises theprocess steps of nickel plating and pure tin atomization; the electric plating post treatment comprises a drying process. A steel belt has the S-shaped trend; the occupied area is greatly reduced; about 1 / 2 of the production line cost is reduced; the phosphorus content in sulfate copper plating is very low, so that the plating layer combination is tighter; a manufactured electronic device cannot easily generate desoldering; the resources can be effectively saved; the safety of personnel is protected.

Description

technical field [0001] The invention relates to an electroplating process, in particular to an electronic connector electroplating process. Background technique [0002] In the original continuous copper plating of steel strips, multiple copper plating tanks, auxiliary tanks and other auxiliary equipment are required. The continuous copper plating production line of steel strips is 80 meters long and occupies a large area. The steel strip production line is about 20,000 yuan per meter , The one-time investment is too large, the overall production efficiency is low, and a large number of staff are required for maintenance operations, resulting in a waste of financial and material resources. In the original continuous copper plating of steel strips, only one or two steel strips can be electroplated at a time. In the content of the present invention, the steel strips are in an S-shaped direction in the pre-treatment tank and the plating tank, which greatly reduces the occupied ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06C25D5/12
CPCC25D7/0614C25D5/12
Inventor 何爱芝云虹闵宇霖沈喜训丁会梅彭红军丁荣军袁小菊
Owner JIANGSU AOGUANG ELECTRONICS
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