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Package box physical structure capable of reducing object breakage

A technology of physical structure and packaging box, which is applied in the direction of transportation and packaging, containers and containers to prevent mechanical damage, etc. It can solve the problems of instrument wear, uneven instrument placement, difficulty in instrument placement and removal, and achieve the effect of slowing up and down vibrations Effect

Inactive Publication Date: 2015-11-11
KONFOONG BIOTECH INT
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the transportation of some precision instruments, due to the unreasonable design of the packaging device, it will cause wear, impact, and paint scraping of the instrument; at the same time, the precision components in the instrument are very sensitive to vibration during transportation, and the offset vibration during transportation is uniform. Risk of damage to delicate components
In the prior art, technicians often place cushioning sponges on the base, but this method does not have a strong cushioning effect during transportation and the instrument is placed unevenly during transportation
At the same time, when the instrument is shipped with a large mass, it is often difficult to place and remove the instrument

Method used

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  • Package box physical structure capable of reducing object breakage

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Embodiment Construction

[0016] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be further described below in conjunction with the accompanying drawings.

[0017] figure 1 with figure 2 It is a schematic diagram of the present invention.

[0018] The reference signs are: base 1, box cover 2, base 3, buffer bottom layer 4, buffer plate 5, load-bearing component 6, buffer layer 7, load-bearing column 8, load-bearing shoe foot 9, fixing member 10, load-bearing column gap 11. Loading and unloading gap 12.

[0019] The present invention will be described in detail and concretely below through specific embodiments, so as to better understand the present invention, but the following embodiments do not limit the scope of the present invention.

[0020] Taking the transportation of a digital pathological slice scanner as an example, the physical structure of a packaging box that can reduce object damage includ...

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Abstract

The invention relates to a package box physical structure capable of reducing object breakage. The package box physical structure comprises a base and a box cover. The base comprises a pedestal, a buffering bottom layer and a buffering plate. The buffering plate is provided with a bearing assembly. A buffering layer is arranged on the inner surface of the box cover. According to the package box physical structure, vertical vibration can be effectively relieved through the buffering bottom layer, and transported instruments can be kept horizontal well through the buffering plate and the bearing assembly. Meanwhile, the buffering layer arranged inside the box cover can comprehensively prevent the instruments from being scratched and damaged in the transporting process. Finally, the loading and unloading operation of heavy instruments can be facilitated through a loading and unloading notch.

Description

Technical field [0001] The invention relates to a transport packaging device, in particular to a physical structure of a packaging box that can reduce object damage. Background technique [0002] During the transportation of some precision instruments, due to the unreasonable design of the packaging device, the instrument will be worn, bumped, and painted. At the same time, the precision parts in the instrument are very sensitive to vibration during the transportation, and the deviation and vibration during transportation are all It may cause damage to precision parts. In the prior art, technicians often place buffer sponges on the base, but this method does not have a strong buffering effect during transportation and the instrument is placed unevenly during transportation. At the same time, it is often difficult to operate the placing and removing of the instruments when shipping large-scale instruments. Summary of the invention [0003] In order to solve the above-mentioned pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D81/05
Inventor 刘炳宪谢菊元王焱辉王克惠刘雅爽
Owner KONFOONG BIOTECH INT
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