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Substrate Assembly Method

A substrate and assembly technology, applied in nonlinear optics, instruments, optics, etc., can solve problems such as deformation adjustment, material waste, and uneven spacing in local areas, to correct alignment offset, improve yield, and improve The effect of assembly accuracy

Active Publication Date: 2018-01-16
KUSN INFOVISION OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the thinning of display devices, the upper and lower substrates of the display panel are also made thinner and thinner. Due to the materials of the upper and lower substrates themselves or the factors of the assembly device, etc., the above assembly method turns over 180 degrees on the upper carrying platform and then descends. In the pressing process, due to the deformation of the upper and lower substrates caused by rotation, pressing, etc., the uneven distance between the local areas after the upper and lower substrates are assembled, etc., the local areas of the upper and lower substrates after assembly are deformed and abnormal alignment occurs.
Adjusting the parameters of the machine can only translate the entire substrate, that is, it can only translate in the four directions of front, rear, left, and right in the plane where the substrate is located, but it cannot be adjusted for the deformation of the local area of ​​the substrate. Therefore, the local area of ​​​​the upper and lower substrates is deformed. It is still difficult to make corrections, which ultimately affects the assembly accuracy of the display panel, resulting in waste of materials

Method used

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Embodiment Construction

[0021] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, features and effects of the substrate assembly method proposed by the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , detailed as follows:

[0022] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. Through the description of specific implementation methods, the technical means and effects of the present invention to achieve the intended purpose can be understood more deeply and specifically, but the attached drawings are only for reference and description, and are not used to explain the present invention limit.

[0023] figure 1 It is a schematic diagram of the ste...

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Abstract

The invention provides a substrate assembly method which is suitable for assembly of a first substrate and a second substrate of a display panel. The substrate assembly method includes the steps that an assembly device with a heating structure is provided; the first substrate is assembled to the second substrate through the assembly device; the local deformation regions of the first substrate and the second substrate after assembly are detected; the local deformation regions are heated through the heating structure to correct alignment offset of the first substrate and the second substrate. By means of the substrate assembly method, deformation of the local regions of the substrates can be corrected in the substrate assembly process, the assembly accuracy of the display panel is improved effectively, and the yield of products is increased.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate assembly method. Background technique [0002] The display panel of the display device has upper and lower substrates arranged opposite to each other, such as a thin film transistor array substrate and a color filter substrate of a liquid crystal display device. In the preparation process of the display device, the method of assembling the upper and lower substrates of the display panel is mainly to place the upper and lower substrates to be assembled on the upper and lower carrying platforms of the assembly device respectively, and pass the upper and lower carrying platforms. The positioner on the platform determines the positions of the upper and lower substrates to be assembled on the upper and lower carrying platforms, and the upper and lower carrying platforms vacuum absorb the upper and lower substrates to be assembled. Then the corrector is used to calibrate ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1333
CPCG02F1/1333G02F1/133325
Inventor 周华陈欢
Owner KUSN INFOVISION OPTOELECTRONICS