Camera module and circuit board of camera module

Abstract

The invention relates to a camera module and a circuit board of the camera module. The circuit board comprises a first circuit board, a reinforcing board and a second circuit board, wherein the first circuit board is provided with an installing surface and a connecting surface which are opposite; the reinforcing board is arranged on the connecting surface; the second circuit board is electrically connected with the first circuit board, and realizes the signal conduction; the installing surface comprises an installing region positioned in the middle part and a peripheral region surrounding the installing region; the installing region is used for installing an image sensing chip of the camera module; a first hollow part hollowing in a direction towards the reinforcing board until the reinforcing board is exposed out is formed in the peripheral region; and through the first hollow part, a lens seat of the camera module can stably stand on a position, corresponding to the first hollow part, of the reinforcing board. The circuit board has the advantages that the lens seat assembled on the circuit board can be effectively prevented from being inclined, so that the camera module has good imaging quality.

Description

technical field [0001] The invention relates to the technical field of mobile terminals, in particular to a camera module and a circuit board thereof. Background technique [0002] Such as figure 1 As shown, the camera module 10 generally includes a lens base 11 , a filter 12 , a circuit board 13 , an image sensing chip 14 and a lens (not shown). The mirror base 11 has a light transmission hole 15 that runs through its upper and lower surfaces, the filter 12 is arranged in the light transmission hole 15, the circuit board 13 is located at one end of the mirror base 11, and the circuit board 13, the optical filter 12 and the mirror base 11 cooperate to form a closed receiving chamber 16. The image sensing chip 14 is disposed on the circuit board 13 and accommodated in the receiving cavity 16 . The lens is arranged on the end of the mirror base 11 away from the circuit board 13 . [0003] Due to the design requirements of the inner layer circuit, the upper surface of the c...

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Problems solved by technology

[0003] Due to the design requirements of the inner layer circuit, the upper surface of the circuit board 13 (the surface connected to the mirror base 11) has corresponding lines, protrusions, etc., resulting in the central axis of the mirror base 11 after the mirror base 11 is assembled on the upper surface of the circuit board 13. Deviating from the positive vertical direction of the surface of the circuit board 13, that is, the central axis of the lens arranged on the mirror base 11 deviates from the positive vertical direction of the surface of the circuit board 13, thereby affecting the imaging quality

That is to say, the flatness of the upper surface of the circuit board 13 is uneven, causing the mirror base 11 to be slightly inclined after being assembled on the upper surface of the circuit board 13, which affects the imaging quality of the camera module

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