Thin substrate deformation measuring method eliminating influence of gravity
A technology that eliminates gravity and measurement methods. It is applied in the direction of measuring devices, instruments, and optical devices. It can solve problems such as pollution, surface tension deformation, and ions, and achieve the effect of flexible placement.
Active Publication Date: 2015-11-18
DALIAN UNIV OF TECH
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[0005] In view of the existing measurement method proposed above, the introduction of surface tension additional deformation, ion pollution, high assembly precision of support mechanism and the need for additional centering mechanism, the present invention researches and designs a thin substrate deformation measurement method that eliminates the influence of gravity
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[0035] A thin substrate deformation measurement method that eliminates the influence of gravity, the thin substrate is supported by three support balls, comprising the following steps:
[0036] ① Determine the positions of the three support balls by measuring;
[0037] ② Place the thin substrate to be tested on three supporting balls to determine the thickness, position and profile information of the thin substrate;
[0038] ③ Input the position information of the three supporting balls measured in step ① and step ② and the thickness, position and profile information of the thin substrate into the finite element analysis software to perform gravity additional deformation simulation and calculate gravity additional deformation;
[0039] ④ The total deformation of the thin substrate is measured by scanning, and the total deformation is subtracted from the additional deformation of gravity measured in step ③ to obtain the real deformation of the thin substrate.
[0040] Such as ...
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The invention discloses a thin substrate deformation measuring method eliminating influence of gravity. A thin substrate is supported by three supporting balls. The method comprises the following steps that the positions of the three supporting balls are confirmed through measurement; the thin substrate to be measured is arranged on the three supporting balls, and thickness and the position of the thin substrate are confirmed; the measured position information of the three supporting balls and thickness, contour and position information of the thin substrate are inputted to finite element analysis software to perform gravity additional deformation simulation, and gravity additional deformation is calculated; and total deformation of the thin substrate is measured through scanning, and the calculated gravity additional deformation is subtracted from total deformation so that real deformation of the thin substrate is obtained. No ion pollution is generated, liquid is not used and surface tension additional deformation is not generated by the method; the method has no requirement for the positions of the supporting balls or assembling precision of the supporting mechanism; and an additional centering mechanism for ensuring the center of the thin substrate to be positioned on a forward and backward measurement overturning shaft is not required.
Description
technical field [0001] The invention relates to the technical field of object deformation measurement methods, in particular to a thin substrate deformation measurement method that eliminates the influence of gravity. Background technique [0002] Thin substrates are thin plates in mechanics, and their geometric features are circular, rectangular or other shapes. Deformation, or optimization of processing to reduce processing distortion, requires measurement of deformation on thin substrates. Due to the low stiffness of the thin substrate, its deformation measurement is affected by the support method and the external environment, such as vibration, airflow and gravity. In the case of vibration isolation and airflow shielding, the influence of gravity becomes a factor that cannot be ignored. At present, when the existing measurement methods measure the deformation of the substrate, the thin substrate is placed horizontally on the platform support, three-point support horizon...
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Inventor 董志刚康仁科刘海军高尚朱祥龙周平陈修艺
Owner DALIAN UNIV OF TECH