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Washing device and method for wafer supporting pieces

A technology for cleaning devices and supports, applied in liquid cleaning methods, cleaning methods and utensils, chemical instruments and methods, etc., to achieve the effects of improving yield, reducing wafer defects, and avoiding contamination

Active Publication Date: 2015-11-25
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a cleaning device and cleaning method for a wafer support to solve the problem of cleaning dead angles in the existing wafer support and improve the cleanliness of the wafer

Method used

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  • Washing device and method for wafer supporting pieces
  • Washing device and method for wafer supporting pieces
  • Washing device and method for wafer supporting pieces

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Embodiment Construction

[0028] In order to make the purpose, technical solution and advantages of the present invention clearer, the following will further describe the implementation of the present invention in detail in conjunction with the accompanying drawings. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0029] The above and other technical features and beneficial effects will be combined with the embodiments and the accompanying Figure 2-3 The wafer support cleaning device of the present invention will be described in detail.

[0030] Such as Figure 2-3 As shown, the present invention...

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Abstract

The invention discloses a washing device and method for wafer supporting pieces. The washing device comprises the first set of wafer supporting pieces and the second set of wafer supporting pieces. The first set of wafer supporting pieces and the second set of wafer supporting pieces are used alternately, and when the first set of wafer supporting pieces are in the stretch-out state, the second set of wafer supporting pieces are in the retracting state, or when the first set of wafer supporting pieces are in the retracting state, the second set of wafer supporting pieces are in the stretch-out state. Due to the fact that the first set of wafer supporting pieces and the second set of wafer supporting pieces are used alternately, when wafers are supported by one set of wafer supporting pieces, the other set of wafer supporting pieces make full contact with washing liquid, the good cleanliness of the wafer supporting pieces is kept all the time, dirt on the wafer supporting pieces is prevented from contaminating the wafers, the defects of the wafers are reduced, and the yield of the wafers is increased.

Description

technical field [0001] The invention belongs to the field of semiconductor wafer cleaning technology, and relates to a cleaning device and a cleaning method for a wafer support. Background technique [0002] As the feature size of integrated circuits enters the deep submicron stage, the cleanliness of the wafer surface required in the integrated circuit wafer manufacturing process is becoming more and more stringent. In order to ensure the cleanliness of the surface of the wafer material, the manufacturing process of the integrated circuit There are hundreds of cleaning processes in the production line, and the cleaning process accounts for 20% of the entire manufacturing process. [0003] Traditionally, tank-type cleaning equipment with relatively high output is used to clean the surface of the wafer. The main cleaning steps of the cleaning equipment are generally cleaning and soaking in chemical liquid, and then cleaning with water. After the wafer is cleaned and soaked i...

Claims

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Application Information

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IPC IPC(8): B08B3/08B08B3/02
CPCB08B3/02B08B3/08
Inventor 姚敏钰李阳柏张传民陈建维
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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