Carriers, reaction chambers and semiconductor processing equipment
A technology of carrying device and reaction chamber, which is applied in semiconductor/solid-state device manufacturing, metal material coating process, ion implantation plating, etc., can solve the problems of polluting particles and film falling off, so as to increase the cost of use and improve the quality of products. quality effect
Active Publication Date: 2018-01-09
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0004] The concrete structure of above-mentioned pressure ring 13 is as image 3 As shown, the two bonding surfaces of the pressure ring 13 and the tray 12 are completely bonded to each other, which will cause such a problem in practical applications, that is, after the film deposition process is completed, the film deposited on the upper surface of the tray 12 and the The film on the upper surface of the pressure ring 13 will be connected together at the junction of the two. When the base 11 descends and the two bonding surfaces of the pressure ring 13 and the tray 12 are separated from each other, the upper surface of the tray 12 and the pressure The film at the junction of the upper surface of the ring 13 will fall off and form pollution particles
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[0029] In order for those skilled in the art to better understand the technical solution of the present invention, the carrying device, reaction chamber and semiconductor processing equipment provided by the present invention will be described in detail below in conjunction with the accompanying drawings.
[0030] Figure 4A A partial schematic diagram of a carrying device provided by an embodiment of the present invention. Figure 4B for Figure 4A Partial enlarged view of the middle I region. Figure 4C for Figure 4A Schematic diagram of the tray in the carrier device. Please also refer to Figure 4A , Figure 4B and Figure 4C , the carrying device includes a tray 22 , a base 21 and a pressure ring 23 . Wherein, the tray 22 is used to carry the workpiece to be processed; the base 21 is used to carry the tray 22 ; the pressure ring 23 is used to fix the tray 22 on the base 21 .
[0031] Moreover, the lower surface of the pressure ring 23 has an annular plane 231 tha...
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Abstract
The carrying device, reaction chamber and semiconductor processing equipment provided by the present invention include the tray, base and pressure ring, where the tray is used to carry the processing of the processing; the base is used to carry the tray;On the foundation, and the surface of the lower surface has a ring plane that fits the edge area on the surface of the tray, and there is also a ring concave part on the edge area of the surface of the tray.The ring -shaped area around the ring hole is overlapped, and the inner edge of the ring concave part is located in the inside of the ring hole.The loading device provided by the present invention can not only avoid pollution particles when the pressure ring and the tray are separated from each other, but also prevent the pressure ring from damaging the tray.
Description
technical field [0001] The invention relates to the technical field of microelectronic processing, in particular to a carrying device, a reaction chamber and semiconductor processing equipment. Background technique [0002] In the manufacturing process of integrated circuits, physical vapor deposition (Physical Vapor Deposition, hereinafter referred to as PVD) technology is usually used to deposit materials such as metal layers on wafers. For example, it is used to prepare ITO (Indium Tin Oxides, nanometer indium tin metal oxide) thin films on LED chips. When implementing the process, due to the small size of LED chips (usually 2 inches or 4 inches, etc.), it is necessary for the carrier to have a tray that can carry multiple LED chips at the same time, and a base to fix the tray in the process chamber The pressure ring on the upper part can realize the preparation of ITO thin films on multiple LED chips at the same time. [0003] figure 1 It is a cross-sectional view of ...
Claims
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IPC IPC(8): C23C14/50
CPCC23C14/50H01L21/68721H01L21/68771H01L21/68735
Inventor 武学伟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD