Multilayer heavy copper circuit board and manufacturing method thereof

Abstract

The invention provides a multilayer heavy copper circuit board and a manufacturing method thereof. The manufacturing method of the multilayer heavy copper circuit board comprises the following steps that multiple heavy copper circuit board core boards comprising multiple internal layer lines and core board insulating layers, and multiple insulating layer are provided; bonding sheets fill in the multiple internal layer lines of each heavy copper circuit board core board in a pressing mode; the multiple internal layer lines of each heavy copper circuit board core board are ensured to be filled and leveled up by the bonding sheets; each heavy copper circuit board core board in which the bonding sheets are filled and each insulating layer are laminated in an alternating way in turn, and a heavy copper board used for manufacturing an external layer line is arranged at the external surface of the outermost insulating layer to perform secondary pressing; and the heavy copper board is etched so that manufacturing of the external layer line is completed. The invention also provides the multilayer heavy copper circuit board manufactured by the manufacturing method. The multilayer heavy copper circuit board is manufactured by two times of pressing so that problems of resin holes and non-uniform thickness in a conventional pressing mode can be solved, and reliability can be enhanced.

Description

technical field [0001] The invention relates to the technical field of multilayer circuit board manufacture, in particular to a multilayer thick copper circuit board and a manufacturing method thereof. Background technique [0002] Circuit board (Printed Circuit Board, PCB) circuit production is to place a copper layer on the insulating layer first, and then etch away the excess copper by etching to form the required circuit pattern. PCB boards are divided into single-sided PCB boards and double-sided PCB boards. Single-sided PCB boards refer to wiring on one side of the insulating substrate, and double-sided PCB boards refer to wiring on both sides of the insulating substrate. Whether it is a single-sided PCB board or a double-sided PCB board, there may be multiple layers of circuits, and adjacent circuit layers are separated by insulating layers. [0003] Heavy copper circuit board (Heavy Copper PCB) refers to a multi-layer circuit board containing more than 3 ounces of c...

AI Technical Summary

Problems solved by technology

[0007] In order to solve the technical problems of resin voids and uneven thickness in the production of multi-layer thick copper circuit boards by the above-mentioned traditional lamination method, the present invention provides a multi-layer thick copper circuit board and a manufacturing method thereof, which can effectively avoid multi-layer thick copper circuit boards. Problems of resin voids and uneven thickness during the production of thick copper circuit boards

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