New chemical copper deposition device
A new type of chemical copper deposition technology, applied in the field of circuit board manufacturing, can solve the problems of large difference in deposition amount and deposition speed, uneven concentration distribution of copper deposition solution, uneven deposition quality, etc., to ensure the quality of copper deposition, The effect of avoiding local scrapping of the board and keeping the temperature stable
Active Publication Date: 2018-06-19
SHANGHAI MEADVILLE ELECTRONICS +1
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Problems solved by technology
However, the traditional electroless copper deposition is carried out in the tank, and the circuit board to be deposited is immersed in the static copper deposition solution placed in the tank body. As the redox reaction proceeds, the concentration distribution of the copper deposition solution becomes more and more uneven. Uniformity, resulting in large differences in the deposition amount and deposition speed of the areas to be deposited on the circuit board, and uneven deposition quality, which reduces the quality of the circuit board
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[0020] The present invention is described in detail below in conjunction with accompanying drawing:
[0021] Such as figure 1 As shown, it is a new electroless copper deposition device. The novel electroless copper deposition device includes a tank body 1, and the tank body 1 is provided with a chamber 11, and the chamber 11 is used for storing a copper deposition liquid. The novel electroless copper deposition device also includes a hanging basket 2. The hanging basket 2 is used to carry the circuit board 01 to be copper-immersed. The hook 21 on the hanging basket 2 is hung on the upper end of the tank body 1, so that the hanging basket 2 carrying the circuit board 01 to be immersed in copper is soaked in the copper sinking liquid in the cavity 11.
[0022] The novel electroless copper deposition device also includes a blower 3 and an air outlet pipe 4 . The air blower 3 is arranged outside the tank body 1 . The air outlet pipe 3 is arranged in the cavity 11 and is locat...
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The invention discloses a novel chemical copper deposition device, which is characterized in that it includes a tank body; the tank body is provided with a cavity; the cavity is used to store copper sinking liquid; a blower; The outside of the body; the air outlet pipe; the air outlet pipe is arranged in the cavity; the air outlet pipe is provided with an air outlet hole; the air outlet pipe communicates with the blower; the air blower blows air into the air outlet pipe , the gas is blown into the cavity from the air outlet, so that the copper deposition liquid in the cavity flows. The new chemical copper deposition device provided by the present invention stirs the copper deposition liquid in the cavity through the gas blown out of the air outlet, so that the copper deposition liquid in the cavity remains uniform and ensures the amount of copper deposition in each copper deposition area on the circuit board and copper sinking speed are consistent to ensure the quality of copper sinking of circuit boards and improve the quality of circuit boards.
Description
technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a novel electroless copper deposition device. Background technique [0002] Electroless copper precipitation is a self-catalyzed redox reaction. The circuit board to be copper-precipitated is soaked in the copper-precipitating solution, and the Cu2+ in the copper-precipitating solution is reduced to metallic copper by electrons and deposited on the circuit board. Electroless copper deposition can be performed on any non-conductive substrate, making copper deposition widely used in the field of circuit board manufacturing. However, the traditional electroless copper deposition is carried out in the tank, and the circuit board to be deposited is immersed in the static copper deposition solution placed in the tank body. As the redox reaction proceeds, the concentration distribution of the copper deposition solution becomes more and more uneven. Uniformity leads to large ...
Claims
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IPC IPC(8): C23C18/38
Inventor 颜国秋武瑞黄周涛黄伟徐守恒付海涛
Owner SHANGHAI MEADVILLE ELECTRONICS