Manufacturing method of flexible substrate

Abstract

The invention discloses a manufacturing method for a flexible substrate. The manufacturing method includes the steps that a glass substrate is coated with a PI layer; the PI layer is treated to be divided into different sub-regions. Because the PI layer is divided into the multiple independent sub-regions, the distribution condition of stress suffered by the PI layer changes, namely, stress concentration on the edge of the PI layer is avoided; in this way, it is avoided that in the high-temperature manufacturing progress, the PI layer makes the glass substrate warped, and then while the yield of the flexible substrate is increased, the production cost of the flexible substrate is lowered.

Description

technical field [0001] The invention belongs to the technical field of liquid crystal display, and in particular relates to a method for manufacturing a flexible substrate. Background technique [0002] In the existing manufacturing method of flexible substrates, firstly, select suitable PI materials, and then coat them on the prepared glass substrates, and then separate the PI materials from the glass substrates by stripping technology after the preparation is completed. . On the basis of the completion of the flexible substrate, the existing flexible display can be obtained by continuing to manufacture TFT elements and vapor-depositing OLEDs. [0003] However, because the PI material will be affected by the high-temperature process, the glass-off substrate will be warped, that is, the high-temperature process will cause greater stress on the flexible substrate, which will cause it and the glass substrate to warp to varying degrees, resulting in subsequent related problems...

AI Technical Summary

Problems solved by technology

[0003] However, because the PI material will be affected by the high-temperature process, the glass-off substrate will be warped, that is, the high-temperature process will cause greater stress on the flexible substrate, which will cause it and the glass substrate to warp to varying degrees, resulting in subsequent related problems. The various processes of the flexible screen cannot operate normally

For example, it will lead to difficulties in the subsequent yellow light alignment process, that is, the lithography exposure cannot be aligned normally, so that the exposure accuracy cannot be controlled, resulting in a decrease in the yield of flexible substrates

[0004] In addition, due to the high cost of the glass substrate, if warping occurs when coating the PI material, the entire glass substrate will be scrapped, which increases the production cost of the flexible substrate

Images