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Apparatus and method for continuous plating

A plating and plating solution technology, applied in gymnastics equipment, sports accessories, muscle training equipment, etc., can solve problems such as defective products, scratches, and long plating time.

Inactive Publication Date: 2015-12-09
INKTEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In this conventional continuous plating method, when the cathode roll is contaminated by the plating solution, defects such as scratches may occur on the surface of the plated material, resulting in defective products.
In addition, since the plating time is long, there is a problem that the plating efficiency decreases

Method used

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  • Apparatus and method for continuous plating
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  • Apparatus and method for continuous plating

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Embodiment Construction

[0037] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.

[0038] figure 1 It is a plan view schematically showing a continuous plating apparatus according to an embodiment of the present invention.

[0039] refer to figure 1 , the continuous plating device comprises a cathode roller (1) and a spray unit (2).

[0040] Such as figure 1 As shown, a plurality of the above-mentioned cathode roller (1) and spray unit (2) may be provided, but it is not necessarily limited thereto, and at least one or more may be provided.

[0041] It is arranged so that the material to be plated (3) including the pattern to be plated (pattern) passes between the plurality of cathode rolls (1).

[0042] Such as figure 2 As shown, the material to be plated (3) may include a base member (31) in the form of a film, and a plurality of pads (32) formed on the surface of the base member. A plating layer may be formed at a contact point...

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PUM

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Abstract

The present invention relates to an apparatus and a method for continuous plating, the apparatus comprising: cathode rollers each having at least the outer surface thereof which is electrically conductive, and disposed so as to come into contact with an object to be plated; a first power source electrically connected to the outer surface of the cathode rollers so as to apply negative electricity thereto; spray units, positioned at a distance from the cathode rollers, for spraying a plating solution containing positive ions in the direction of the object to be plated; and a first storage tank, connected to the spray units, for supplying the plating solution to the spray units.

Description

technical field [0001] The present invention relates to a continuous plating device and a continuous plating method, and more specifically, to a continuous plating device and a continuous plating method capable of realizing high-speed plating and maximizing efficiency. Background technique [0002] Generally, in the case of plating a thin-plate-shaped product such as a printed circuit board (PCB, Printed Circuit Board) substrate, as disclosed in Patent Document 1, a horizontal plating method in which the material to be plated is continuously plated is used. . This conventional plating method is formed by including a plating tank for storing the plating solution and feeding and discharging the material to be plated, an insoluble anode (anode), and allowing the material to be plated to pass through the plating tank. The transfer roller (roller) that moves the material to be plated in the horizontal direction, and the plating device of the cathode (cathode) roller that is loca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D17/12
CPCC25D7/0621C25D17/10H05K2203/0723H05K2203/0746H05K2203/1545A63B17/02A63B21/0442A63B23/03558
Inventor 郑光春温雄龟韩英求尹光伯
Owner INKTEC CO LTD
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