A kind of electroforming preparation method of silver solder with high indium content

A silver brazing material and content technology, applied in the field of welding materials, can solve the problems of large wetted area, low melting point of brazing material, low indium content, etc., and achieve the effects of fast thermal diffusion, firm bonding and smooth surface
CN106757205BInactive Publication Date: 2018-08-28NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
Publication Date
2018-08-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses an electroforming preparation method of high-indium-content silver solder. The specific steps are as follows: (1) Electroplating is performed with the silver solder as the cathode and the indium plate as the anode. The composition of the electroplating solution is: In2+metal salt 20‑ 130g / L, 40‑120ml / L strong acid or 35‑65 g / L medium strong acid, 2‑80 g / L additive; 450°C high-temperature pipe for 30-50min; then placed in a tube furnace at 160-180°C for 6-10h; finally annealed at 450-500°C, and then rolled or drawn. The electroforming preparation method of the present invention has fast deposition rate, short plating time, high preparation efficiency, simple and convenient operation, and low cost, and solves the problems of low indium content and poor plasticity in the current AgCuZnIn solder, and the prepared solder The content of indium is high, which can reach 2.5-15%, and the solder has a low melting point, good plasticity, easy processing and preparation, and good wettability.
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Description

technical field

[0001] The invention belongs to the technical field of welding materials, and in particular relates to an electroforming preparation method of silver solder with high indium content. Background technique

[0002] Silver solder has a moderate melting point, good workmanship, good strength, toughness, thermal conductivity, electrical conductivity and corrosion resistance, and can be used to join low-carbon steel, structural steel, high-temperature alloys, copper and its alloys, etc. Adding Cd and In elements to the AgCuZn ternary alloy can significantly reduce the liquidus of the ternary alloy and improve its brazing process, but the silver solder containing Cd element is extremely harmful to human beings, and its application is subject to certain restrictions. limit. At the same time, in the AgCuZn solder containing In, the In element should not be too high (less than 3.5%), otherwise the plasticity of the solder will be reduced and it will easily become brit...

Claims

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