39results about How to "Short plating time" patented technology

A technology for plating the nano-Ni working layer on the surface of roller of the dual-roller thin-band conticaster includes such steps as cleaning the surface of roller, and electrochemical cleaning, activating, plating of binding layer and plating of Ni layer by moving the plating pen along the roller surface at the rotation speeds of 10-14, 12-16, 12-16 and 14-20 rpm under the voltages of 14-16, 18-20, 22-24 and 16-24 V.

The invention discloses a multi-layer nickel electroplating additive for improving stability. The multi-layer nickel electroplating additive is prepared from raw materials of 2-15 mL / L of a cylinder opening agent, 1-10 mL / L of a microporous nickel additive and 1-2 mL / L of a wetting agent according to the concentration in a plating solution. The invention further discloses a nickel plating processcontaining the multi-layer nickel electroplating additive. The multi-layer nickel electroplating additive is added into the electroplating solution at the addition volume of 1-1.4 mL / L, and during nickel plating, the temperature of the plating solution is 50-60 DEG C, the current density is 16-19 mA / cm<2>, and the electroplating time is 18-25 min.

The invention provides a multi-stage nickel plating process and relates to the technical field of electroplating. The electroplating solution of the nickel plating process includes nickel sulfamate, nickel bromide and boric acid. The electroplating process includes the following stages: pre-plating stage: current density is 0.1-0.2ASD, pre-plating time is 240-360s; first stage: current density is 0.4-0.7ASD; electroplating time is 840-960s; second stage: current The density is 0.5~0.8ASD, the plating time is 4000~4600s; the third stage: the current density is 0.4~0.6ASD; the plating time is 3200~3800s; the fourth stage: the current density is 0.2~0.4ASD; the plating time is 1200~ 2200s. By setting a staged electroplating method, the instantaneous current damage to the coating is avoided. In the last two electroplating stages, the crystallization of the coating surface is corrected to prevent burns on the coating surface and significantly improve the welding performance.

The invention discloses a method for preparing a large-aperture uniform optical filter and belongs to the technical field of optical films. The method solves a possible transmittance decrease of the optical filter due to the slight drift of a central wavelength because of the high sensitivity of a large-aperture narrowband optical filter to the central wavelength. The method comprises plating a substrate with a half of a total film system and optically bonding the two plated films in opposite directions so as to help improve the uniformity of the large-aperture narrowband optical filter. Results show that the method contributes to the improvement of the uniformity of the large-aperture narrowband optical filter and achieves the preparation of the large-aperture uniform narrowband optical filter.

The invention discloses a cyanide-free chemical gold-plating solution and a gold-plating process applied to the field of advanced packaging of wafers. 10-60g / L; conductive salt 10-60g / L; buffer 30-60g / L; anti-aging agent 5-10g / L; surfactant 15-80mg / L; wetting agent 1-5mg / L; reaction Accelerator 50-80mg / L; Stabilizer 0.2-5mg / L; The reaction accelerator is a compound of 2,6-diaminopyridine and 3-pyridinemethanol, and 2,6-diaminopyridine and 3-pyridine The mass concentration ratio of methanol is 2:1. The solution obtained by the invention not only ensures the stability of the plating solution, but also makes it easy to spread the plated parts on the surface of the electrode to achieve the purpose of uniform plating, and further achieves the effect of filling the micropores of the wafer package without voids and gaps.

The invention discloses a nickel plating solution applied to printed circuit boards and a nickel electroplating method thereof, comprising components with the following mass concentrations: nickel salt 35-50g / L; conductive salt 20-40g / L; anti-aging agent 10 ‑15g / L; composite complexing agent 5‑15g / L; reaction accelerator 50‑80mg / L; stress reliever 50‑80mg / L; surfactant 5‑10mg / L; composite stabilizer 0.2‑5mg / L ; The composite complexing agent includes A component and B component, and the A component and the B component are 3:1-2 according to the mass concentration ratio; the A component includes a mass concentration of 1-5g / L citric acid, 1‑2g / L ammonium acetate, 1‑5g / L malic acid. The solution of the invention ensures the bond strength between the plating layer and the substrate, so that the nickel plating layer has good adhesion and uniformity of the plating layer; the process not only ensures the uniformity of electroplating, but also shortens the electroplating time.

The invention discloses a mesoporous molecular sieve composite laser direct forming material, which comprises the following components in terms of weight percentage: 70-95% polycarbonate; 1-10% laser direct forming additive; 1-5wt% Phosphate ester / mesoporous molecular sieve hybrid material; 1-15wt% toughening agent; 0.5-5% other additives. The phosphate ester / mesoporous molecular sieve hybrid material is prepared from phosphate ester and mesoporous molecular sieve. The invention also discloses a phosphate / mesoporous molecular sieve hybrid material and a preparation method thereof. The beneficial effects of the present invention are: the phosphate / mesoporous molecular sieve hybrid material can promote the char formation in the laser activation process and help to shorten the plating time; at the same time, the special structure of the mesoporous molecular sieve is helpful for the metal to be deposited on the surface of the substrate. Adhesion, and can significantly improve the bonding strength between the coating and the substrate.

The invention belongs to the technical field of metal surface electroplating, and relates to a cyanide-free imitation gold electroplating solution and a magnesium alloy electroplating process thereof. Electroplating solution includes: Potassium pyrophosphate 200~300g / L, copper pyrophosphate 18~24g / L, stannous pyrophosphate 1.5~2.6g / L, zinc sulfate 40~50g / L, hydroxyethylidene diphosphonic acid 15~20g / L, AESS 2~3mL / L and imidazole ionic liquid 1~3mol / L; pH is 8‑9. Electroplating process: (1) Degrease, pickle and activate the magnesium alloy sample in sequence; (2) Then perform zinc dipping, zinc stripping, and secondary zinc dipping treatments; (3) Magnesium after zinc dipping treatment Alloy sample at room temperature, current density 0.1‑2A / dm 2 Electroplating for 10‑180s, cleaning and drying. The imitation gold electroplating solution of the invention is environmentally friendly and has good stability; the imitation gold coating obtained by electroplating on the surface of the magnesium alloy has high quality and good discoloration resistance.

The present invention relates to a nickel-free ferrous tin-cobalt alloy plating solution and a process for utilizing the plating solution for electroplating. The plating solution comprises the following compositions: 0.2 to 6 g / L of tin, 0.6 to 4 g / L of cobalt, 8 to 180 g / L of complexant, 2 to 20 g / L of melanizing agent and 50 to 320 g / L of pH buffer. The parameters of the plating solution are as follows: the Baume of the plating solution is between 10 and 25 baume degrees; the temperature is between 28 and 48 DEG C; and the pH is between 10 and 13. The coating of the nickel-free ferrous tin-cobalt alloy plating solution is an alloy layer taking the tin as a main material, and a small amount of cobalt is added into the coating to form a binary alloy system; the cobalt content in a general ferrous tin-cobalt alloy plating solution exceeds 8 g / L, but the novel electroplating process can reduce the cobalt content to 0.8 g / L; and due to adoption of the special biodegradable stable complexant and the special biodegradable pH buffer, the production cost can be reduced, novel EU standards can be reached simultaneously, and various problems of the prior ferrous tin-cobalt alloy plating solution and the prior process can be solved.

The invention discloses a preparation method of a composite coating for Cr-containing stainless steel protection in fused fluoride salt. The method comprises the following steps that (1) stainless steel is selected as a cathode base material, and a nickel sheet is selected as an anode base material; (2) the cathode base material and the anode base material are placed in a nano composite plating tank, nano composite pulse plating is carried out during stirring, and a Ni(NiO) transition layer is prepared; (3) the base materials are subjected to stirring and nickel plating in a bright nickel plating tank; and (4) the base materials are put in a container full of inert gas shielding to be subjected to heat treatment, the temperature of heat treatment ranges from 850 DEG C to 900 DEG C, the time of heat treatment is 8 h, Cr in the bas materials reacts with NiO in the transition layer, and then a Cr2O3 diffusion barrier is grown out on the surface in situ. According to the method, operationis simple and convenient; controllability of the plating layer is high; the anticorrosion effect is good; the electroplating time is reduced; few additives of plating liquid are needed; cost is reduced, and meanwhile pollution to the environment is reduced; and the compactness and binding force of the prepared coating are good.

The invention discloses an electroforming preparation method of high-indium-content silver solder. The specific steps are as follows: (1) Electroplating is performed with the silver solder as the cathode and the indium plate as the anode. The composition of the electroplating solution is: In2+metal salt 20‑ 130g / L, 40‑120ml / L strong acid or 35‑65 g / L medium strong acid, 2‑80 g / L additive; 450°C high-temperature pipe for 30-50min; then placed in a tube furnace at 160-180°C for 6-10h; finally annealed at 450-500°C, and then rolled or drawn. The electroforming preparation method of the present invention has fast deposition rate, short plating time, high preparation efficiency, simple and convenient operation, and low cost, and solves the problems of low indium content and poor plasticity in the current AgCuZnIn solder, and the prepared solder The content of indium is high, which can reach 2.5-15%, and the solder has a low melting point, good plasticity, easy processing and preparation, and good wettability.

The present invention relates to a continuous plating device and a continuous plating method. The continuous plating device includes: a cathode roll having at least an outer surface that is electrically conductive and the outer surface is in contact with a material to be plated; A first power supply, which is electrically connected to the outer surface of the cathode roller to apply cathode electricity to the outer surface; a spray unit, which is positioned in a manner spaced apart from the cathode roller, to the surface of the material to be plated directionally spraying a plating liquid containing anode ions; and a first storage tank connected to the spraying unit to supply the plating liquid to the spraying unit. According to the present invention, not only the plating area can be widened, but also the plating time can be reduced to maximize the efficiency.