Mesoporous Molecular Sieve Composite Laser Direct Structuring Materials and Its Application

Abstract

The invention discloses a mesoporous molecular sieve composite laser direct forming material, which comprises the following components in terms of weight percentage: 70-95% polycarbonate; 1-10% laser direct forming additive; 1-5wt% Phosphate ester / mesoporous molecular sieve hybrid material; 1-15wt% toughening agent; 0.5-5% other additives. The phosphate ester / mesoporous molecular sieve hybrid material is prepared from phosphate ester and mesoporous molecular sieve. The invention also discloses a phosphate / mesoporous molecular sieve hybrid material and a preparation method thereof. The beneficial effects of the present invention are: the phosphate / mesoporous molecular sieve hybrid material can promote the char formation in the laser activation process and help to shorten the plating time; at the same time, the special structure of the mesoporous molecular sieve is helpful for the metal to be deposited on the surface of the substrate. Adhesion, and can significantly improve the bonding strength between the coating and the substrate.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to compound modification of laser direct structuring additives and preparation and application of corresponding laser direct structuring materials. Background technique [0002] LDS, or Laser Direct Structuring, is a 3D-MID production technology with professional laser processing, injection and electroplating processes. Its principle is to endow ordinary plastic components / circuit boards with electrical interconnection functions, support component functions and plastic shells Support, protection and other functions, as well as the shielding and antenna functions produced by the combination of mechanical entities and conductive graphics, are suitable for the production of local thin lines. [0003] LDS can avoid environmental pollution and water consumption caused by traditional plastic electroplating process to a large extent, simplify the production process, and provide f...

AI Technical Summary

Problems solved by technology

If the laser direct structuring additive is not properly selected, it may cause defects such as silver wires and pitting on the surface after injection molding, resulting in slow or even unplating of electroless plating in the later stage, and the failure of the 100-grid test; or the decline in mechanical properties after electroless plating Obviously, it cannot meet the requirements of material performance

[0005] At present, when traditional laser direct structuring additives are used for the production of LDS engineering plastic parts, there is such a contradiction: the increase in the amount of laser direct structuring additives often leads to a decrease in the physical properties of the substrate

However, when the amount of laser direct structuring additives is low, the electroless plating performance is often unsatisfactory, and the bonding strength between the coating and the substrate is also poor, which cannot meet the needs of various occasions

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