Continuous plating device

Abstract

The present invention relates to a continuous plating device and a continuous plating method. The continuous plating device includes: a cathode roll having at least an outer surface that is electrically conductive and the outer surface is in contact with a material to be plated; A first power supply, which is electrically connected to the outer surface of the cathode roller to apply cathode electricity to the outer surface; a spray unit, which is positioned in a manner spaced apart from the cathode roller, to the surface of the material to be plated directionally spraying a plating liquid containing anode ions; and a first storage tank connected to the spraying unit to supply the plating liquid to the spraying unit. According to the present invention, not only the plating area can be widened, but also the plating time can be reduced to maximize the efficiency.

Description

technical field

[0001] The present invention relates to a continuous plating apparatus and a continuous plating method, and more particularly, to a continuous plating apparatus and a continuous plating method capable of realizing high-speed plating and maximizing efficiency. Background technique

[0002] Generally, in the case of plating a thin plate-shaped product such as a printed circuit board (PCB) substrate, as disclosed in Patent Document 1, a horizontal plating method in which a material to be plated is continuously plated is used. application method. Such a conventional plating method includes a plating tank that stores a plating solution and supplies and discharges the material to be plated, an insoluble anode (anode), and passes the material to be plated through the plating tank. It is realized by a plating device of a transfer roller that transfers the material to be plated in the horizontal direction, and a cathode roller that is positioned in front of a plating...

Examples

Embodiment Construction

[0037] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0038] figure 1 This is a plan view schematically showing a continuous plating apparatus according to an embodiment of the present invention.

[0039] refer to figure 1 , the continuous plating device includes a cathode roll 1 and a spray unit 2 .

[0040] like figure 1 As shown, a plurality of the cathode rolls 1 and the spray unit 2 may be provided, but it is not necessarily limited to these, and at least one or more may be provided.

[0041] The material to be plated 3 including the pattern to be plated is arranged so as to pass between the plurality of cathode rolls 1 .

[0042] like figure 2 As shown, the material to be plated 3 may include a base member 31 in the form of a film, and a plurality of pads 32 formed on the surface of the base member. A plated layer may be formed on the contact point between the pad 32 and the cathode...

technical field

[0001] The present invention relates to a continuous plating apparatus and a continuous plating method, and more particularly, to a continuous plating apparatus and a continuous plating method capable of realizing high-speed plating and maximizing efficiency. Background technique

[0002] Generally, in the case of plating a thin plate-shaped product such as a printed circuit board (PCB) substrate, as disclosed in Patent Document 1, a horizontal plating method in which a material to be plated is continuously plated is used. application method. Such a conventional plating method includes a plating tank that stores a plating solution and supplies and discharges the material to be plated, an insoluble anode (anode), and passes the material to be plated through the plating tank. It is realized by a plating device of a transfer roller that transfers the material to be plated in the horizontal direction, and a cathode roller that is positioned in front of a plating...

Examples

Embodiment Construction

[0037] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0038] figure 1 This is a plan view schematically showing a continuous plating apparatus according to an embodiment of the present invention.

[0039] refer to figure 1 , the continuous plating device includes a cathode roll 1 and a spray unit 2 .

[0040] like figure 1 As shown, a plurality of the cathode rolls 1 and the spray unit 2 may be provided, but it is not necessarily limited to these, and at least one or more may be provided.

[0041] The material to be plated 3 including the pattern to be plated is arranged so as to pass between the plurality of cathode rolls 1 .

[0042] like figure 2 As shown, the material to be plated 3 may include a base member 31 in the form of a film, and a plurality of pads 32 formed on the surface of the base member. A plated layer may be formed on the contact point between the pad 32 and the cathode...

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