Mesoporous molecular sieve compound laser direct structuring material and application thereof

Abstract

The invention discloses a mesoporous molecular sieve compound laser direct structuring material. The mesoporous molecular sieve compound laser direct structuring material is prepared from, by weight, 70-95% of polycarbonate, 1-10% of a laser direct structuring additive, 1-5% of a phosphate ester / mesoporous molecular sieve hybrid material, 1-15% of a flexibilizer and 0.5-5% of other additives. The phosphate ester / mesoporous molecular sieve hybrid material is prepared from phosphate ester and a mesoporous molecular sieve. The invention further discloses the phosphate ester / mesoporous molecular sieve hybrid material and a preparation method thereof. The mesoporous molecular sieve compound laser direct structuring material, the phosphate ester / mesoporous molecular sieve hybrid material and the preparation method thereof have the advantages that the phosphate ester / mesoporous molecular sieve hybrid material can promote the carbon formation action during laser activation, and is conductive to shortening the plating time; the special structure of the mesoporous molecular sieve is conductive to the adhesion of metal to the surface of a base material, and can significantly improve the bonding strength between a cladding layer and the base material.

Description

Technical field [0001] The invention relates to the technical field of polymer materials, in particular to the compound modification of additives for laser direct structuring and the preparation and application of corresponding laser direct structuring materials. Background technique [0002] LDS, or laser direct molding, is a 3D-MID production technology of professional laser processing, injection and electroplating processes. Its principle is to give ordinary plastic components / circuit boards the electrical interconnection function, the support component function and the plastic shell The functions of support, protection, etc., as well as the shielding, antenna and other functions produced by the combination of mechanical entities and conductive patterns are combined in one, suitable for local thin circuit production. [0003] LDS can largely avoid the environmental pollution and water consumption of traditional plastic electroplating process, simplify the production process, and...

AI Technical Summary

Problems solved by technology

If the laser direct structuring additive is not properly selected, it may cause defects such as silver wires and pitting on the surface after injection molding, resulting in slow or even unplating of electroless plating in the later stage, and the failure of the 100-grid test; or the decline in mechanical properties after electroless plating Obviously, it cannot meet the requirements of material performance

[0005] At present, when traditional laser direct structuring additives are used for the production of LDS engineering plastic parts, there is such a contradiction: the increase in the amount of laser direct structuring additives often leads to a decrease in the physical properties of the substrate

However, when the amount of laser direct structuring additives is low, the electroless plating performance is often unsatisfactory, and the bonding strength between the coating and the substrate is also poor, which cannot meet the needs of various occasions

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