Mesoporous molecular sieve compound laser direct structuring material and application thereof

A technology of laser direct structuring and mesoporous molecular sieve is applied in the preparation of laser direct structuring materials and the compound modification of laser direct structuring additives. Achieve the effect of improving bonding strength, shortening plating time, and improving carbon-forming ability
CN110283441AActive Publication Date: 2019-09-27无锡赢同新材料科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
无锡赢同新材料科技有限公司
Publication Date
2019-09-27

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Abstract

The invention discloses a mesoporous molecular sieve compound laser direct structuring material. The mesoporous molecular sieve compound laser direct structuring material is prepared from, by weight, 70-95% of polycarbonate, 1-10% of a laser direct structuring additive, 1-5% of a phosphate ester / mesoporous molecular sieve hybrid material, 1-15% of a flexibilizer and 0.5-5% of other additives. The phosphate ester / mesoporous molecular sieve hybrid material is prepared from phosphate ester and a mesoporous molecular sieve. The invention further discloses the phosphate ester / mesoporous molecular sieve hybrid material and a preparation method thereof. The mesoporous molecular sieve compound laser direct structuring material, the phosphate ester / mesoporous molecular sieve hybrid material and the preparation method thereof have the advantages that the phosphate ester / mesoporous molecular sieve hybrid material can promote the carbon formation action during laser activation, and is conductive to shortening the plating time; the special structure of the mesoporous molecular sieve is conductive to the adhesion of metal to the surface of a base material, and can significantly improve the bonding strength between a cladding layer and the base material.
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Description

Technical field

[0001] The invention relates to the technical field of polymer materials, in particular to the compound modification of additives for laser direct structuring and the preparation and application of corresponding laser direct structuring materials. Background technique

[0002] LDS, or laser direct molding, is a 3D-MID production technology of professional laser processing, injection and electroplating processes. Its principle is to give ordinary plastic components / circuit boards the electrical interconnection function, the support component function and the plastic shell The functions of support, protection, etc., as well as the shielding, antenna and other functions produced by the combination of mechanical entities and conductive patterns are combined in one, suitable for local thin circuit production.

[0003] LDS can largely avoid the environmental pollution and water consumption of traditional plastic electroplating process, simplify the production process, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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